Electronics Forum | Wed Apr 26 03:32:29 EDT 2006 | saaitk
Hi all, Has anyone any experience they can share with regard to pad dissolution on PTH's on thick boards. We are using lead free SAC305 on both OSP and Immersion silver finishes and are experiencing difficulties when removing and replacing connector
Electronics Forum | Fri Mar 07 15:20:11 EST 2003 | davef
O'Connor: IPC-A-610, section 12.4.4 SMT Soldering Anomolies - Nonwetting was added primarily to accomidate OSP boards. Heated flux is used to remove the 'lacguer'. So, you end-up with a copper colored border [or shadow] around the pads, where there
Electronics Forum | Thu Apr 14 06:00:01 EDT 2005 | bryan
The shelf life of immersion silver is 6 to 12 months in good storage conditions. The finish is usually coated with a protective layer that inhibits oxidation (like with copper OSP). Care must be taken when handling the boards as the protective la
Electronics Forum | Thu Sep 02 14:02:49 EDT 2004 | russ
Frank, We are currently running lead free for approximately 1 yr. now but no where near the volumes you have mentioned. We are about 5k units per month. I personally am in agreement with you as far as OSP. I also do not like white tin finish since
Electronics Forum | Tue Jun 05 21:14:10 EDT 2001 | davef
You aren't going to post our stuff on your "Hey, I'm the wizard site", are you? Board fab, Pad coatings, OSP 1 OSPs: Imidazole (Via Systems) is good. Entek (Enthone) works, but requires strict thickness control in fab. 2 Enthone CU56 allows one t
Electronics Forum | Sat Jun 30 11:28:24 EDT 2001 | davef
Consider using a roll solder with a flux that well matches the residues you can accept to be remaining on the board when you get finished processing. Many people use a no-clean flux cored roll solder for such operations, because they don't want to c
Electronics Forum | Thu Oct 26 17:48:12 EDT 2000 | ptvianc
Hi: Generlly speaking, in a reactive mode, nitrogen blankets are used to improve the yield of a process that is marginal in terms of removing, and/or preventing the re-appearence of, oxides on copper features or component I/Os. That marginality can
Electronics Forum | Fri May 31 10:35:46 EDT 2002 | dason_c
I think that the IPC spec only apply to the MSD. I had a paper from Lucent and forwarded by Francois Monette, please aware that the first 2 hours, the moisture doesn't bake out from the assembly/component and result show that it is increase the weigh
Electronics Forum | Wed Jul 04 12:35:19 EDT 2001 | davef
I thought I responded this this a while ago, guess NOT!!! Wow, Dano yagot Entek boards that are that old!!!! Coo. Sounds kwazy that you�d end-up with that volume of old boards, but it�s probably one of those deals where correcting the problem keep
Electronics Forum | Thu Jul 22 22:18:12 EDT 2004 | davef
Notes from an AIM No-Lead Presentation ... Wave Soldering * May require a higher pot temperature than tin/lead: 255-265*C * May require a change in liquid fluxes to compensate for the poor wetting of some alloys and high thermal stresses of the wave
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