Ersa HOTFLOW 3/14 Reflow Oven Reflow Oven SMT Reflow Oven Ersa HOTFLOW 3/14 Reflow Oven Product description: Ersa HOTFLOW 3/14 Reflow Oven Ersa HOTFLOW 3/14 Reflow Oven Specifications: Excellent heat transfer with
New Equipment | Industrial Automation
Want to buy best parts with a competitive price ? Please check it with mailto:unity@mvme.cn! we will response you in 24 hours! Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ
Classic Empathy SMT Stencil Printer Max PCB:300*340mm PCB weight ≤3kg Weight:1400Kg size:1400(L)X1540(W)X1500(H)mm Product description: Classic Empathy SMT Stencil Printer Fully Automatic, Max PCB:300*340mm, PCB weight ≤3kg, size:1400(L
Classic Navigator SMT Stencil Printer Max PCB：510*510mm PCB weight ≤3kg Weight:1000Kg dimensions:1320mm(L)*1690mm(W)*1510mm(H) Product description: Classic Navigator SMT Stencil Printer Fully Automatic, Max PCB：510*510mm, PCB weight ≤3k
New Equipment | Wave Soldering
Selective Wave Soldering Machine max solder temperature 350℃ solder pot capacity 15 KG Net weight 380KG dimension L1280mm X W1400mm X H1650mm Product description: Selective Wave Soldering Machine, max solder temperature 350℃ solder pot capacit
Demonstrates desoldering, solder paste printing, and installation of a fine pitch QFP 208 (30.6mm x 30.6mm) component using an ATCO model AT-GDP Placement & Rework Station.
Ersa HOTFLOW 3/14e Reflow Oven Ersa HOTFLOW 3/14E Length: 4,770 mm* 1,201 mm* 1,375 mm Working width: 45-516 mm Conveyor speed: 20-200 cm/min Product description: Ersa HOTFLOW 3/14e Reflow Oven, Ersa HOTFLOW 3/14E, Length: 4,770 mm* 1,201 mm*
Ersa HOTFLOW 3/20e Reflow Oven Ersa HOTFLOW 3/20e Dimensions:6,265 mm*1,201 mm*1,375 mm Working width: 45-516 mm Conveyor speed: 20-200 cm/min Product description: Ersa HOTFLOW 3/20e Reflow Oven, Ersa HOTFLOW 3/20e, Dimensions:6,265 mm*1,201 m
Industry News | 2009-11-02 22:48:29.0
HOFFMAN ESTATES, IL — November 2009 — Hattas & Associates, a manufacturers’ representative firm specializing in electronics assembly, in conjunction with Lee Herrmann from Technology Plus, announces that it will highlight numerous products and technologies at the upcoming Wisconsin/Great Lakes Expo & Tech Forum, scheduled to take place Tuesday, November 10, 2009 at the Wyndham Airport Hotel in Milwaukee, WI.
Demonstrates installation of a BGA component using the AT-707 BGA Rework Station. Features include split vision optics, software process control, and lead free reflow capable.
