Electronics Forum | Wed Dec 08 11:26:04 EST 2010 | davef
3 Printer Area Conditions * As stated earlier, heat and humidity are damaging to solder paste. Ideally, the printing area should be maintained at 40% - 50% relative humidity and 72°- 80°F (22-26°C). In addition, no air (cool or warm) should blow dire
Electronics Forum | Mon Oct 26 02:00:36 EDT 2020 | chucherry5076
https://www.jrpanel.com/R The heat generated by electronic equipment causes the internal temperature to rise rapidly. If the heat is not dissipated in time, the equipment will continue to heat up and the components will overheat and fail, resulting
Electronics Forum | Mon May 20 21:29:52 EDT 2002 | davef
Q1: Are we saying then that IMC can occur at the solder / Cu pad join on the PCB when finished assembled? A1: Yes, but in a broader context I am saying that when someone solders correctly, they form an IMC. Q2: Will the tin diffuse with the Cu over
Electronics Forum | Thu Oct 30 21:55:27 EST 2003 | johnwnz
Now I've checked the archives on this and found the starts of an answer but not much else, but then that posting was a while ago and I though there would be some more data now. So here's the question: who, if anyone is placeign Pb-free BGA's (ideally
Electronics Forum | Wed Sep 10 09:56:18 EDT 2003 | vickt
5 years ago (mostly likely 7-8 yrs). Most of these failures can be attributed to simple overtemp conditions or mechanical stress. Customers who do not keep the cooling fan filters clean on their machines tend to see a higher failure rate due to highe
Electronics Forum | Thu Apr 29 12:20:23 EDT 1999 | Tony A
| | Anyone using hot air nife for wave soldering process. | | Does it work? | | Does it really eliminate solder bridging and does it create any other problems? | | | | any feed back will be much appriciated. | | | | Thanks | | | | Tony A | | |
Electronics Forum | Wed Feb 23 00:16:23 EST 2000 | Finepitch Services
Sal, Jax has a good point about utilizing your multi-profile oven and switching to a different profile. However, since some ovens cause trouble while cooling off and stabilizing, I will assume you do have to use the same profile for whatever reason.
Electronics Forum | Wed Feb 23 00:16:23 EST 2000 | Finepitch Services
Sal, Jax has a good point about utilizing your multi-profile oven and switching to a different profile. However, since some ovens cause trouble while cooling off and stabilizing, I will assume you do have to use the same profile for whatever reason.
Electronics Forum | Sat Aug 03 07:29:20 EDT 2002 | davef
IPC-PE-740 "Troubleshooting for Printed Board Manufacture and Assembly" has words to the effect of � 1.5---BAKING Laminate materials are baked several times during the manufacture of a printed wiring board. There are four major reasons for
