Industry News | 2023-03-16 14:59:50.0
The success of the CHIPS for America program depends on establishing a U.S. pilot facility for manufacturing integrated circuit (IC) substrates; and getting it done sooner, incrementally, is better than doing it perfectly, according to a new industry report.
BGA integrated circuits and chip scale packages, CSPs where the solder connections are not visible. This has arisen as a result of the need for greater numbers of interconnections to integrated circuit packages and as a general result of increasing c
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | ,
BGA Rebaling Webinar
Industry News | 2014-08-28 08:40:16.0
BEST announces a new service for the short term hiring of certified soldering technicians and source inspectors with IPC qualifications.
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