FactoryLogix is an integrated suite of software modules and devices that bring speed, control and visibility to your manufacturing operations. To learn more visit www.aiscorp.com
Career Center | Dallas, Texas USA | Engineering
This position is available in Gaithersburg,MD. A BS degree is required. 10+ years in procurement from manufacturing enviornment, PCBA, bare beards manufacturing knowledge required, financial analysis in support of make/buy decision. The functions o
Career Center | Dallas, Texas USA | Engineering
This individual will manage the development and production of out-sourced OEM devices used in world-class telecommunication systems; assess supplier capabilities; lead the specification and supplier interaction of custom/specialty assemblies; and sup
Career Center | Houston, Texas USA | Engineering
Are you looking for a challenging opportunity that will utilize your education and expertise? Leading Energy company client needs another PhD or MS with SMT and complex advanced technology expertise. Must have excellent experience with PCBA, MCM an
Industry News | 2003-08-05 14:31:57.0
The next step along path to profitable growth will result in the layoff of about 325 employees.
Industry News | 2008-06-03 11:45:09.0
PCB Solutions has announced the addition of new SMT equipment which features the latest in Assembleon Pick-and-Place technology. With the recent trend of many of the industry's leading Original Electronics Manufacturers outsourcing within the U.S, the young and growing company will further position itself as a capable and quality solution for high-mix/low-volume PCB Assembly runs.
Industry News | 2012-07-31 14:36:26.0
2012 Design-2-Part Survey Reveals Outsourcing Trends
Career Center | , Pennsylvania USA | Sales/Marketing
****WORK FROM HOME IN E. PA, NJ, MD AND DE TERRITORY**** Maintain and grow electronics business through a combination of bookings, sales, and margins to develop and sustain future growth of the company Develop new, qualified customers with needs th
ITS is a pure electronics contract manufacturing and assembly company. We offer continuing leadership in both manufacturing technology and process improvement.
Technical Library | 2016-08-11 15:49:59.0
The challenge for 3D IC assembly is how to manage warpage and thin wafer handling in order to achieve a high assembly yield and to ensure that the final structure can pass the specified reliability requirements. Our test vehicles have micro-bumped die having pitches ranging from 60um down to 30um. The high density of pads and the large die size, make it extremely challenging to ensure that all of the micro-bump interconnects are attached to a thin Si-interposer. In addition, the low standoff between the die and interposer make it difficult to underfill. A likely approach is to first attach the die to the interposer and then the die/interposer sub-assembly to the substrate. In this scenario, the die/interposer sub-assembly is comparable to a monolithic silicon die that can be flip chip attached to the substrate. In this paper, we will discuss various assembly options and the challenges posed by each. In this investigation, we will propose the best method to do 2.5D assembly in an OSAT(Outsourced Assembly and Test) facility.
