108038 JSNA11A-1C CONTROL TEMPERATURE 20' CAP 96616 JSNA11B-1C CONTROL TEMPERATURE 20' CAP 166053 JSNA19AAC-9C DIFFERENTIAL FIXED 100/240 5F 207381 JSNA19ABA-40C CONTROL TEMP REM BULB 104566 JSNA19ABC-24C THERMOSTAT REMOTE BULB 98260
Electronics Forum | Wed Feb 04 10:01:55 EST 2009 | dcell_1t
Hi there, We're developing a DOE where stencil design (aperture design) is going to be evaluated, currently we have regular reduction on sides, home base (triangular and semi-circle), "C" or "U" shape, and an idea for oval shape for pasives also cam
Electronics Forum | Fri Mar 02 06:25:04 EST 2001 | PeteC
Thanks for your feedback. All the 0603 chips have the round solder lands but the 0805 chips and larger are rectangular. After speaking with the designer on it he said they chose round lands for the 0603 chips to get higher density of the circuit trac
Electronics Forum | Fri Jan 31 05:18:10 EST 2003 | reg
We have a customer who is going to be using the new Snapshot process. Has anyone used this process all ready. Who did you use to make the tooling etc. Was there any problems that arose during this process. The process involves screening balls into s
Electronics Forum | Thu Feb 13 07:13:39 EST 2003 | davef
Tell us more about the location of the bridging [ie, front-to-back, back-to-back, front-to-front, etc]. Thoughts are: * Your annular ring around the hole seems large. You have 0.007", consider 0.003" to be the minimum. Your board fabricator can gi
Electronics Forum | Wed Jun 12 12:35:03 EDT 2013 | deanm
Dan, Can you upload a picture of the bridging? Why oval pads? Have you considered using round pads with the smallest practical annular ring? In my opinion, an oval pad would potentially hold more solder because there is more exposed area, and the m
Electronics Forum | Fri Jul 31 17:21:38 EDT 1998 | MMurphy
31 mil pitch components go either 1:1 or reduce 1 mil per side (you can reduce further if the foil thickness is > 7 mil.), you may want to try an oval shape here also.
Electronics Forum | Fri Jul 31 17:23:11 EDT 1998 | MMurphy
31 mil pitch components go either 1:1 or reduce 1 mil per side (you can reduce further if the foil thickness is > 7 mil.), you may want to try an oval shape here also.
Electronics Forum | Fri Jul 31 17:24:12 EDT 1998 | MMurphy
31 mil pitch components go either 1:1 or reduce 1 mil per side (you can reduce further if the foil thickness is > 7 mil.), you may want to try an oval shape here also.
Electronics Forum | Wed Aug 05 07:44:18 EDT 1998 | Joe Vella Ottosen
31 mil pitch components go either 1:1 or reduce 1 mil per side (you can reduce further if the foil thickness is > 7 mil.), you may want to try an oval shape here also.
