Technical Library | 2019-07-02 23:02:05.0
The introduction of lead-free solders resulted in a selection of different chemistries for solder pastes. The higher melting points of lead-free alloys required thermal heat resistant rosin systems and activators that are active at elevated temperatures. As a result, more frequent maintenance of the filtration systems is required and machine downtime is increased.Last year a different method of cleaning reflow ovens was introduced. Instead of cooling down the process gasses to condensate the residues, a catalyst was used to maintain the clean oven. Catalytic thermal oxidation of residues in the nitrogen atmosphere resulted in cleaner heating zones. The residues were transformed into carbon dioxide. This remaining small amount of char was collected in the catalyst. In air ovens the catalyst was not seen as a beneficial option because the air extracted out of the oven was immediately exhausted into the environment. When a catalyst is used in an air environment there is not only the carbon dioxide residues, but also water. When a catalyst is used in an air reflow oven the question is where the water is going to. Will it condensate in the process part of the oven or is the gas temperature high enough to keep it out of the process area? A major benefit of using a catalyst to clean the air before it is exhausted into the environment is that the air pollution is reduced dramatically. This will make environmental engineers happy and result in less pollution of our nature. Apart from this, the exhaust tubes remain clean which reduces the maintenance of air ovens.This paper will give more detailed information of catalyst systems during development and performance in production lines.
-Individual module heat zone design is convenience for maintenance -Adopts ��Star Shape Heater�� that is high solder performance for BGA, QFP components
Used SMT Equipment | Soldering - Reflow
TrioTek: Ultraviolet UV Curing, IR Thermal Curing, Moisture Curing for encapsulants, adhesives, conformal coatings and potting compounds TrioTek™ inline curing ovens from ETS are ideal for medium to high-volume curing or drying of encapsulants, con
The Vitronics Soltec MR+ product platform offers exceptional thermal transfer, temperature control accuracy, and cooling. The two models of MR+ contain over 10 patents including a gas recirculation system that reduces N2 consumption up to 30%, and th
Heller Industries the market leader in oven technology, supplies solutions for electronics manufacturers and assemblers worldwide. Heller uses advanced manufacturing and production systems to supply both standard and special ovens cost-efficiently, w
Used SMT Equipment | Soldering - Reflow
HELLER 1707EXL OVEN BRAND NEW IN CRATE (7) Zone Top & (7) Zone Bottom Heat (Max. Temperature 350C) (1) Cooling Zone Edge Rail & Mesh Belt (Left To Right) LEAD FREE READY 208-240 VAC 3 Phase 100A WINDOWS XP OS SAVE OVER 50
The Despatch RA Reach-In Oven is designed with the user in mind. Features include user-friendly controls; small footprint to conserve valuable floorspace; front access maintenance panel; and ergonomic design. The RA Reach-In Oven features high volume
Industry News | 2012-01-19 23:27:14.0
BTU International will highlight its next-generation High Efficiency (HE) Flux Management and new dual-lane, dual-speed capabilities of the PYRAMAX™ solder reflow system in Booth #3409 at the upcoming IPC APEX Expo.
Industry News | 2012-04-26 20:46:21.0
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, announces that it has been awarded a 2012 EM Asia Innovation Award in the category of Reflow Soldering Equipment for its PYRAMAX™ 100N convection reflow oven.
Industry News | 2012-03-28 16:37:08.0
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, will highlight its next-generation High Efficiency (HE) Flux Management and dual-lane, dual-speed capabilities of the PYRAMAX™ solder reflow system as well as its latest WINCON™5.0 control system