Industry News | 2018-12-08 03:22:25.0
Electronic Components, Parts and Their Function
Electronics Forum | Wed Aug 28 18:08:07 EDT 2002 | MikeF
This looks like it may be a good application for an Air-Vac or Wenesco type solder station. It is a solder pot that has a small motor to pump solder up through a chimney. You can put different nozzles on the top of the chimney, so you only apply sold
Electronics Forum | Mon Aug 26 20:33:50 EDT 2002 | davef
Not as such. Generally, people tailor their profiles to produce glam solder connections on their boards. Search the fine SMTnet Archives for discussion on the factors affecting solder reflow recipes. What is the best way to get these PCB made to s
Electronics Forum | Mon Aug 26 09:50:32 EDT 2002 | zanolli
I want to ascertain the oven profile required for through hole connectors with solder pre-forms. I need to get double sided PCB�s made for that purpose. What is the best way to get these PCB�s made to simulate real world conditions?. Should I leave a
Electronics Forum | Wed Jan 17 07:28:29 EST 2007 | davef
Look here: http://www.smtinfo.net/Db/_Reflow%20Soldering.html
Electronics Forum | Thu Apr 24 12:18:01 EDT 2014 | cyber_wolf
You must thermally profile your circuit boards with a data-logger and thermocouples. Just putting in oven set points and looking at solder joints is not enough. Reference IPC-7530
Electronics Forum | Sat Apr 11 14:31:16 EDT 1998 | Gary Simbulan
| | I would like to invite everyone to share/discuss | | information/knowledge/experience they have with | | the req's that are assumed to be valid for the | | temperature/time relation in the process of reflow | | soldering Pin In Paste, Intrusive R
Electronics Forum | Mon Apr 13 07:55:48 EDT 1998 | justin medernach
Dear Justin, I am not asking for experiences with ovens as to whether you think they are capable of THT reflow. I am asking more specifically about actual req's and experiences with THT reflow, regardless of the oven used. Your answer does not hold i
Electronics Forum | Wed Apr 21 17:27:27 EDT 2004 | russ
We always use the regular production reflow profile when we use this method. Since you don't want to do that, All that is required is to ramp the part up to temp to get the balls to melt. If you don't exceed 2C per sec. in a ramp you will be fine.
Electronics Forum | Wed Apr 21 11:33:20 EDT 2004 | tigerlordgm
As one of our small batch processes, we place BGAs on PCB without using solder paste. We apply tacky flux to a predetermined height on a pallet, "dip" the BGA into the tacky flux to wet the solder balls to the set height, and then use a BGA rework st
