Electronics Forum | Wed Apr 21 11:33:20 EDT 2004 | tigerlordgm
As one of our small batch processes, we place BGAs on PCB without using solder paste. We apply tacky flux to a predetermined height on a pallet, "dip" the BGA into the tacky flux to wet the solder balls to the set height, and then use a BGA rework st
Electronics Forum | Fri Apr 10 10:04:44 EDT 1998 | justin medernach
| I would like to invite everyone to share/discuss | information/knowledge/experience they have with | the req's that are assumed to be valid for the | temperature/time relation in the process of reflow | soldering Pin In Paste, Intrusive Reflow or w
Electronics Forum | Thu Feb 16 02:03:36 EST 2017 | soldertraining
Reflow ovens and wave solder machines come in a huge variety of flavors and price points. These machines tell the story of impressive features and capabilities such as flux management, gas flow management, static pressure control, active cooling zone
Electronics Forum | Sun Mar 19 12:11:09 EST 2006 | Cal Kolokoy
Larry, 180 Deg. C (?) to start the profile seems a tad on the high side for a 7-zone oven. You risk too high of a ramp rate and solder beading. At 7 zones, there's no reason to get too hot that fast.
Electronics Forum | Tue Jun 11 11:25:57 EDT 2019 | don_julio
> If the board is just not reaching the temps you > need, you could place them in an oven to > "preheat" them. When I was building a > rather thick board with a copper core I had to do > this. Since we were only doing sma
Electronics Forum | Thu Jan 27 14:16:14 EST 2000 | Tuan Bui
I've tried Indium NC-SMQ92(96.5Sn 3.5Ag) on these MCMs and achieved only marginal wetting on pads and parts. The good wetting is what I try to achieve, shiny is what my engineers want (Prototype environment). Does pre-cleaning the PWBs in ultrasonic
Electronics Forum | Thu Aug 10 13:16:17 EDT 2000 | Bob Willis
Here is some thing that I wrote a while back on solder beading. First what is a Solder Bead? The term solder bead is used to differentiate it from solder balls. A solder bead is a solder ball but its location is normally constant unlike solder bal
Electronics Forum | Mon Aug 07 10:22:13 EDT 2000 | genglish
Ramon, I have had experience in the problems you are witnessing. The problem can relate to a number of factors. Obviously the printing process is the first place to start your investigations, try looking at the stencil apertures for bleed under the
