Electronics Forum | Thu Mar 06 18:21:29 EST 2003 | ppwlee
Mike, What is the most common method for monitoring and calculating machine capability for: - Reflow oven, I currently run a carrier monthly to monitor its temperature profile and would like to simplify the process. - P&P machines: We don't have a
Electronics Forum | Wed Apr 19 03:10:30 EDT 2006 | Slaine
I solder a lot of differnt products throught a Reflow oven that are non PCB baised Axial leaded components typicaly, mounted vertically in jigs. where i can for cost reasons I use aluminium jigs but you have to experiment with the thermal mass and de
Electronics Forum | Thu Aug 27 11:18:05 EDT 2015 | dyoungquist
From your description I am assuming you are doing double sided reflow and parts are dropping off the bottom side when the board is run through the reflow oven the second time. A few ideas to try: 1) Are the parts that are dropping off heavier parts
Electronics Forum | Tue Sep 13 09:50:06 EDT 2005 | slthomas
"I think the best is to make sure the oven profile and other factors are set up so as to avoid any opens in the first place." I think you answered your own question. The difficulty (from my limited experience, anyway) in adequately qualifying your
Electronics Forum | Fri Mar 07 08:47:45 EST 2003 | msivigny
Hello Peter, In reflow, running a profile and collecting thermal data does not necessarily make it easy to calculate and determine machine capability. On the contrary to your desires of simplifying the process, determining machine capability on an ov
Electronics Forum | Sat Aug 14 20:40:20 EDT 2004 | Grant
Hi, We are currently using the profiler built into our Soltec oven, but are looking for something better and does anyone have any ideas. We want to be able to quickly analyze the profile against solder paste and component profiles so we can quickly
Electronics Forum | Mon Aug 16 20:22:54 EDT 2004 | Grant
Hi, Thanks for the info! In the software can you add solder paste specs and heat sensitive components and see where the profile sits against these fast? Measurement is the easiest part I think, but what I thinks harder is good software to analyze th
Electronics Forum | Wed Dec 20 23:29:32 EST 2006 | Jack
Hi all, Is there anyone know the correct way to obtain the accurate temperature profiling for oven reflow? Are below claims true? (1) Instead of full components on the PCBA (Motherboard), the profile taken from PCBA with few components can be cons
Electronics Forum | Thu Jan 22 03:18:02 EST 1998 | Eldon Sanders
I'll bet the rate of temperature change may be the problem. A large black thin package will heat quickly, and the package peak temp will be greater than what you measured on the board. The bottom of the package will heat slower than the top, creati
