Electronics Forum | Tue May 20 09:34:28 EDT 2008 | roc2x
Well something is different isn't it? * Paste * > Part supplier * Board fabrication * Was the > profile that you reference the measured > temperature or the the settings keyed into the > oven? > > The cross sections seem to show less > than exp
Electronics Forum | Sat Nov 17 12:58:12 EST 2007 | mika
I agree with previous postings regarding print speed: Solder paste type/versus fine pitch. Question: Is this a double sided pcb with fairly easy component packages on both sides? In such case, consider make the panel like this: Every second pcb in
Electronics Forum | Tue Mar 13 12:54:58 EDT 2007 | hynergy
You required the process control equipments. 1) Paste Height Checker: To measure the solder paste thickness after printing. 2) Temperature Profiler: To measure the reflow oven temperature whether is within the control spec.
Electronics Forum | Mon Sep 28 16:15:57 EDT 2009 | davef
That your solder connections reflow properly when heated with a soldering iron, indicates that that your reflow recipe needs improvement. * Thermocouple the pads that require touch-up and adjust your oven recipe to assure that they reach liquidous+20
