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Wave soldering profiling

Electronics Forum | Fri May 07 12:39:01 EDT 2004 | rontdc

Bruce, Using a foam fluxer with no-clean flux is a very touchy situation. It is imperative that the specific gravity of any flux be maintained within the manufacturers recommendations. If it is not, you will get icicles and bridging. Maintaining the

Re: Chip Resistor Failure

Electronics Forum | Mon Mar 22 16:59:15 EST 1999 | B K

| Has any one seen failures of chip resistors after 1-2 years where the junction between the silver termination and the restive element on the top of the ceramic has corroded through. This results in a high resistance failure after this period of tim

Re: Spray Fluxers

Electronics Forum | Tue Mar 16 14:05:04 EST 1999 | Steve Skinner

| Does anyone have any recommendations on spray fluxers? Are there major differences between the high priced ultrasonic machines to the low priced flux/air spraying machines? We are going to be spraying an OA flux with 11% solids content. Are there a

Throiugh Hole pad missing after selective soldering

Electronics Forum | Wed Apr 13 12:10:47 EDT 2022 | winston_one

Hello! We have a strange effect. Some pads of big trough-hole DDR slot just dessapear. Initialy it was soldered with selective soldering process (leaded, 290 degrees, ImSn finish, very short storage). Then some connectors with poor barrel fill we hav

Re: Chip Resistor Failure

Electronics Forum | Tue Mar 23 02:32:23 EST 1999 | Bob Willis

| | Has any one seen failures of chip resistors after 1-2 years where the junction between the silver termination and the restive element on the top of the ceramic has corroded through. This results in a high resistance failure after this period of t

Re: Chip Resistor Failure

Electronics Forum | Wed Mar 24 02:23:14 EST 1999 | P.L. Sorenson - Technical Consultant

| | | Has any one seen failures of chip resistors after 1-2 years where the junction between the silver termination and the restive element on the top of the ceramic has corroded through. This results in a high resistance failure after this period of

Re: SMT soldering

Electronics Forum | Fri Jul 24 16:03:56 EDT 1998 | Boris Akselrud

Dave, Thanks for your responce. I think I can manage to solder components by hand. But I am trying to find out an alternative way to solder them. The distance between leads becomes very small and if solder gets in between them I will have hard times

MOLE's Oven rider

Electronics Forum | Mon Jan 04 22:59:23 EST 1999 | Kris Ewen

I'd like to add something about the ECD product. During a past work term (I'm a a co-op student) in an SMA plant, I worked extensively with the Super MOLE Gold in developing the reflow profiles for high-mix, low-volume production. I was 'married' t

Sm t t net
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