Electronics Forum | Wed Dec 13 08:28:37 EST 2000 | CAL
1)having the leader tape overlap and taped square is key. 2)making sure the Butt splice of the carrier tape is cut square and come together with no gaps 3) I would put a piece of yellow splice tape on the underside of the carrier tape to help hold th
Electronics Forum | Fri Jan 21 05:18:55 EST 2000 | Dean
If at all possible avoid mirror assembly BGA designs. It has a higher failure rate when compared to non-overlap designs (life testing). In addition, from a rework point of view, X-ray inspection yields no help when a failure occures. You can't det
Electronics Forum | Tue Aug 31 02:15:12 EDT 2004 | AOI Solution
I need to address the issue for colorful display on solder joints, for whoever researched on this machine, no one can deny it is a smart feature for visual assistance. however, it is still Mono color "gray scale" algorithm. it basically "paint" the i
Electronics Forum | Tue Sep 14 07:54:05 EDT 2004 | modwyer
Folks, At the moment I bake all BGA that are in unsealed trays, to reduce moisture etc. Is this common practice or are there particular manufacturuers that cause more problems. Also, the tape for BGA tape & reel has a hole in the tape (as is normal
Electronics Forum | Thu Sep 30 18:23:00 EDT 2004 | russ
Comment: A 20 mil pad for a .5mm pitch BGA? That seems like an awful large pad for this device. If my math is right the pads will be basically touching each other. .5mm = .020". I would think that you have something else. You cannot have a 22mil
Electronics Forum | Wed Feb 23 16:20:57 EST 2005 | JB
We also ahve GSM's and paste on the nozzles is not an issue here. my question would be: Why is paste getting on the nozzle? The nozzle should only come into contact with the surface of the component being placed, not the paste. If that is the case
Electronics Forum | Tue Jan 31 12:13:26 EST 2006 | Calvin Kolokoy
Today's regular Sn-Pb paste chemistries are designed to run at higher peak temperatures ensuring that your lead-free alloys will coalesce with your regular Sn-Pb solder. That being said, it is do-able to solder both types in one oven. Generally, wit
Electronics Forum | Fri Mar 16 06:54:40 EDT 2007 | bbl
My company is also looking at AOI. There is one group that is promoting flying probe ICT as well. We can only afford to purchase one or the other this year. Does anyone have data that compares advantages/disadvantages of each? I see them as comp
Electronics Forum | Wed Jul 25 10:57:08 EDT 2007 | cecil
Our board layout folks are currently designing a PWB using a 132 QFN. The component is .5mm pitch with .35mm square pads. The component manufacturer recommends the following footprint: .4mm square land .3mm square solder resist 1.why do they spec
Electronics Forum | Wed Sep 19 16:38:07 EDT 2007 | jseagle
Of course there are differences, different equipment, software, tools, etc... We just got a set of questions from a PCB house asking about soldermask clearance between 16 mil pitch pads. Our current manufacturer can put down 3 mils of soldermask.
