Electronics Forum | Mon Jul 14 12:11:17 EDT 2014 | rgduval
We used to use the Tapesplicer tool available from http://www.tapesplice.com (Sierra Electronics), in a high mix, low volume environment with MyData's (older feeders). Short review: It worked. Longer review: First, technique is everything. Splicin
Electronics Forum | Tue Jul 13 14:47:35 EDT 2004 | cyber_wolf
I have a brand new X/Y/Theta table for an SPM(The one that uses magnetic supports) that I would like to trade for an older version table.(The one that has holes drilled and tapped in it.) the one I trade for has to be in good condition. No stripped h
Electronics Forum | Fri Nov 30 22:59:34 EST 2007 | bvdb
Hi Paul, It may not be the perfect replacement for a proper fiducial but I have had some success using thru-holes for fiducials. The tightest pitch part we place is 0.8mm however 0.032"). If the thru-holes are drilled accurately and you are able t
Electronics Forum | Sun Sep 13 19:56:21 EDT 2009 | 89jeong
Hi All I have a pig problem after reflow. It is a blister in hole.It happend after reflow(Lead free solder) I touched the blister with tweezer. The plating was lifted off easily How do i do? What is a root casue? Drilling or plating? Is it possible
Electronics Forum | Wed Sep 01 08:16:55 EDT 2010 | sachu_70
Drill holes or tooling holes have higher tolerances than Fiducial marks during PCB fabrication. I would certainly recommend Fiducial recognition as a more reliable approach for better accuracy. You could re-calibrate the Vision system file used for
Electronics Forum | Wed Jul 28 20:14:22 EDT 1999 | Dave F
| While inspecting incoming PCBs we detected around all plated-through-holes (only there and all in the same place) some halfmoonshaped light rings that match obviously only with the pink ring symptom shown in the IPC-A-600 chapter 2.5.2.. That would
Electronics Forum | Tue May 02 13:57:21 EDT 2006 | patrickbruneel
What you can do is perforate the board holding rim by drilling holes of 0.6mm (similar to via's). This will reduce the mass and heatsinking capacity, allow excess flux drainage and facilitate convection heat contacting the board through the holes. Th
Electronics Forum | Fri Mar 26 17:12:17 EST 2004 | ben
I have recently encountered a new pcb design with a very high density of components on either side of the pcb. One of the suggested "fixes" is to use the smt pads as vias i.e. the via will be drilled thorough the centre of the smt pad. My concern i
Electronics Forum | Wed Feb 15 07:28:08 EST 2006 | tk380514
Well thats what i was thinking of doing and i am not worried about the designer of the PCB. He truly is a dick and i have had many fights with before about wave soldering pad sizes yet he insists he is right but i change them anyway and send the orig
Electronics Forum | Wed Oct 19 07:44:33 EDT 2005 | davef
When a hole is drilled during board fabrication, it can transfer resin from the base material (eg, FR4 core or prepreg) to cover the exposed edge of conductive material in the wall of a drilled hole. This is called resin smear. Etchback is a control
