New Equipment | Solder Materials
Flux designed specifically to work with KappZapp7, 7.0% Silver solder to remove the oxide layer on Copper to allow a strong metallic bond between the solder and the base metal. Its active range is 500°F - 750°F (260°C - 390°C). Kapp Copper-Bond Flux
New Equipment | Solder Materials
KappFreeA the acid cored convenient one-step, Lead-free, Cadmium-free, Potable Water Solder produces strong and ductile joints on Copper and Brass without requiring additional liquid or paste flux. The internal acid flux is released on heating to rem
Oleophobic and Hydrophobic Electronics Coatings Aculon's repellency treatments can be used to modify a broad range of materials used in electronic applications including metals, metal oxides, polymers, and ceramics. Hydrophobic and oleophobic repel
New Equipment | Rework & Repair Equipment
Desoldering braid (wick) is copper braid used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics. Electronic components are often mounted on a circuit board and careful desoldering of components results i
New Equipment | Solder Materials
eFlux Selection: Rosin Based Flux for Lead-Free Wave Soldering NS-F850. NS-F850 ensures excellent wetting of all PCB and component substrates to deliver maximum through hole fill and facilitates the solder drainage that ensures minimum bridges an
New Equipment | Wave Soldering
> ◇Windows XP operation software with Chinese and English alternative available, whole machine under integration control can display the failure and save all production data for further analysis. ◇External streamline design and modularized desi
New Equipment | Wave Soldering
> ◇Windows XP operation software with Chinese and English alternative available, whole machine under integration control can display the failure and save all production data for further analysis. ◇External streamline design and modularized desi
New Equipment | Wave Soldering
> ◇Windows XP operation software with Chinese and English alternative available, whole machine under integration control can display the failure and save all production data for further analysis. ◇External streamline design and modularized desi
Nitrogen is an essential part of the selective soldering process. Soldering without a nitrogen atmosphere leaves solder joints open to the possibility of oxidizing. Individual components will not maintain the long term reliability expected in the har
New Equipment | Selective Soldering
Nitrogen is an essential part of the selective soldering process. Soldering without a nitrogen atmosphere leaves solder joints open to the possibility of oxidizing. Individual components will not maintain the long-term reliability expected in the har
