ACP 120 series are an anti-oxidation solderable coatings, which have been designed for anti-corrosion and rusting for metal surfaces such as nickel, steel, aluminum and other metals; solderable surfaces on which solder paste, solder preform or solder
Our products include custom-made parts made of the following materials and fabricated to your specifications. AC 998 Aluminum Oxide Quartz Sapphire Silicon 99.5% Aluminum Oxide Aluminum 6061 Aluminum Nitride Celazole Graphite Macor Pyrex Silicon C
New Equipment | Solder Materials
The Solder-Saver, from Aprotec: offers the opportunity to instantly recyle dross created in the solder pot. Hot dross is scooped up from the surface of the wave solder pot by the hand held, lightweight Solder-Saver. The unit separates dross oxides
New Equipment | Solder Materials
OAJ Cored Wire features a halide-activated system that has been neutralized with an amine. The aminehydrohalide provides a high activation level that produces excellent tarnish or oxide removal, and maximum capillary action, leading to faster wetting
New Equipment | Rework & Repair Equipment
The TMT-ASTC automatic solder tip cleaner helps rework badly oxidized tips. Two high quality brass brushes, which revolve in opposite directions, aid in the removal of oxidisation from the soldering tip. Removes tip oxidation Light & compact, tak
Industry Directory | Manufacturer
Manufacturer of batteries (particularly coin or button cells). Renata is a subsidiary of The Swatch Group.
Industry Directory | Manufacturer
Non-Dispersive Infrared Bench Manufacturers for Gas Det.
Industry Directory | Manufacturer / Other
Clariant Cargo & Device Protection offers a complete portfolio of desiccants and humidity indicator cards for use in dry packing.
Career Center | Corpus Christi, Texas USA | Engineering,Production
Improve and expand capabilities related to thin film sputtering/CVD deposition as required by Operations and the Business Unit. This position reports directly to the Engineering Manager. Responsibilities: Continuous improvement of sputtered th
General Purpose (SMT and Leaded Styles): Thick Film Chips and Arrays (SMT), NTC Chip Thermistors (SMT), Carbon Film (LD), Metal Film (LD), Metal Oxide Film (LD) and SIP Networks (LD)
