| http://etasmt.com/cc?ID=te_news_bulletin,23568&url=_print
) • Misaligned solder mask (overlapping solder pad and print area) • Flux is too weak for the oxidation level of the board and/or components
| https://pcbasupplies.com/s3x58-hf1100-3-600gm/
-remove protective layer and the antioxidant in the flux suppresses continued oxidation over time. Such effects help save the amount of activator needed for oxidation prevention, as well as the activator capping technique which allows maximum activation strength when the solder is molten
