Industry News | 2023-11-29 08:24:43.0
Precautions for Welding Stainless Steel Pipe
Industry News | 2019-05-16 01:27:23.0
There are several surface treatment for PCB board: bare board (no treatment on the surface), rosin board, OSP (Organic Solderability Preservatives), HASL (lead tin, lead-free tin), plating gold, immersion gold, etc., these are relatively conscious treatment. Many people can't tell the difference between plating gold and immersion gold, thinking that it is the same thing, it is a big mistake. The following is a brief introduction to the difference between plating gold and immersion gold.
Industry News | 2021-05-19 03:32:15.0
Analytical Instrument are a large class of instrument used for analytical applications in chemical, pharmaceutical, clinical, food-processing laboratories, oil refineries and many other field. The instruments help in analyzing materials and establishing the composition.
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Industry News | 2018-10-18 09:34:29.0
Application of lead-free solder
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Electronics Forum | Thu Jul 29 21:11:13 EDT 2004 | davef
Could be lots of things. With limited information about temperatures, solder alloy, and cleaning; we'll swing for the fence that you got these solder connections very hot. So hot that Pb oxide is dominating the solder joint surface instead of the
Electronics Forum | Wed Jul 28 17:34:27 EDT 2004 | Steve Stach
Hi Ralf, This discoloration may be re-oxidation. Fluxes are supposed to do three things (1) remove oxide, (2) promote wetting, and (3) protect surface from reoxidation. The solder paste possibly is not protecting from reoxidation. Best Regards, St
Electronics Forum | Tue Aug 22 11:23:40 EDT 2000 | Dr. Ning-Cheng Lee
Plating houses seem to exhibit various results. Unacceptable Ni oxidation levels appear to be related to poor Pd plating processes. Ni oxidation can occur at 3 process stages: 1) prior to the Pd being applied (Ni already oxidized) 2) during the p
