Electronics Forum | Wed Apr 09 11:23:02 EDT 2003 | davef
Nice pix. The pebbly texture that you're seeing is aptly called "orange peel". Temperature appears to significantly influence the appearance of solder spheres during soldering. Indeed, when the reflow temperature is high, tin continues smelting long
Electronics Forum | Thu Dec 08 22:25:23 EST 2005 | davef
Grant Copper Oxide [Cu2O]: Color is red to a deep red that can appear almost black. Luster is adamantine or submetallic to dull or earthy if massive. Transparency: Crystals are transparent to translucent. Look here: http://mineral.galleries.com/min
Electronics Forum | Thu Oct 22 22:01:33 EDT 2020 | SMTA-64386500
Hi John - send me an email (david.hillman@collins.com) and I can send you a few photos of what Mike K. was describing in terms of the solder joint surface being "etched" by the cleaning solution. The dull appearance is due to the abundance of lead o
Electronics Forum | Tue Dec 11 16:09:02 EST 2001 | mparker
What is the composition of tin to lead in the "Liquid Tinner"? It's been my experience that the higher the tin, the duller the solder appears. I've used 63/37 and 70/30 that both look shiny, whereas 80/20 does look dull. Just another thought to cons
Electronics Forum | Fri Aug 01 23:43:52 EDT 2003 | Yngwie
Thanks Dave, the residue appeared to be similar to fungus. First, I thought it could come from water soluble flux but, our plant only runs no-clean. So, can I concluded that this greenish "fungus" looking staff is not initiated from high hot air temp
Electronics Forum | Wed Jan 05 23:46:10 EST 2011 | Shean Dalton
In addition to reducing oxides my understanding is that nitrogen increases the surface tension of solder (I've also read the inverse). Bottom line, Nitrogen reduces rework, improves quality, improves solder appearance, and reduces maintenance. Shea
Electronics Forum | Thu Aug 29 06:48:01 EDT 2002 | yngwie
I have seen several Imm Ag pad on the assembled board which have a copper colorleaching through the silver plating This happened on the pad which was not deposited with paste during the assembly process. Don't know if it is a problem, but we only
Electronics Forum | Thu Jan 24 09:53:56 EST 2002 | davef
You didn�t tell us about your solder, wave temperature profile, or the distribution of the problem. So, let�s assume the solder is near eutectic and the problem is wide spread. Wolfgang makes good points. So, let's talk a different tact. When we
Electronics Forum | Tue Mar 15 07:59:07 EST 2005 | mattkehoe
We are looking for some feedback on this situation. Please let us know if you have any ideas. Thanks in advance. I have been doing some studies on defects and such with our PCB's in prep for lead free and I've come to a conclusion about our process.
Electronics Forum | Fri Oct 27 10:35:36 EDT 2000 | Chris
We are having problems soldering this motorola part(XPC860TZP50B5). After reflow, some of the balls appear to be sitting on the reflowed paste rather than wetted to it. We reviewed parts and found oxidation on many. We have four other BGA's, from oth
