Electronics Forum | Tue Sep 21 13:10:10 EDT 1999 | Dave F
| Dear All, | | In order to understand the soldering technologies in SMT, I'd like to understand why some cards are soldered and then cleaned, or only soldered whitout water cleaning nor "ultra sound" wavelength. | | I mean that I wonder why we use
Electronics Forum | Wed Nov 10 11:31:06 EST 1999 | John Thorup
Hello Horace You're lucky in that you have two of the same machine. You should be able to arrive at the root of the problem by comparison. The problem is likely to occur in one or more of these areas: MACHINE: As said , pump speed and air contact ar
Electronics Forum | Tue Sep 07 20:46:55 EDT 1999 | Jeff Ferry
| | | My company is starting a prototype. The chips that will be used appear to be very sensitive. The vendor part number is Neta-40-2. | | | My question is what solder temp should be used for this part? | | | Any advice is appreciated. | | | THX. |
Electronics Forum | Fri Sep 25 12:26:34 EDT 2009 | clampron
Some information on the web regarding RoHS and tip life... What problems are there for using Lead-free solder? ? Higher melting point of Lead-free solder may cause physical and thermal damage to components and PCB. ? Lead-free solder has poor
Electronics Forum | Mon May 14 17:12:20 EDT 2001 | davef
Continuing along the path that Brian took ... IPC-7525 gives design guideline for stepped stencils. It goes something like: * Stepped area SB GT 25 thou from pads located on the greatest thickness of the stencil * Pads in stepped area SB GT 35 tho
Electronics Forum | Sun Nov 08 15:27:25 EST 2015 | davef
Thinner: Flux thinner, NOT paint thinner We kept a spare stone in thinner in inventory. We cut PVC pipe to size, cap in one end, screw thread on the other, stone inside, filled with flux thinner and covered with a screw cap. I don't remember who we
Electronics Forum | Sun Apr 18 00:26:29 EDT 1999 | Vic Lau
| | | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | | | I consider "fines" individual unmelted metal sph
Electronics Forum | Wed Sep 22 02:45:23 EDT 1999 | Brian
| | Dear All, | | | | In order to understand the soldering technologies in SMT, I'd like to understand why some cards are soldered and then cleaned, or only soldered whitout water cleaning nor "ultra sound" wavelength. | | | | I mean that I wonder
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Thu Apr 15 15:07:20 EDT 1999 | Mark Charlton
| | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | I consider "fines" individual unmelted metal spheres that ar
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