Full Site - : oxidation on solder joint reflow (Page 11 of 28)

Re: Poor solder joints on QFP 100's

Electronics Forum | Mon Dec 13 19:34:09 EST 1999 | Steve Thomas

Thanks, gentlemen. All points well taken, and some hit pretty close to home. Our pick-and-place programmer assures me that coplanarity isn't the issue because the machine won't (or can't) place parts beyond an acceptable criteria. It's an Amistar

Strange empty ball on chip component after reflow

Electronics Forum | Thu Nov 30 08:09:19 EST 2006 | INGE

Hi everybody, The matter is this: after reflow, on top side leads of chip components (resistor 0805)appear some empty balls of solder. In some cases this thing is only on the lead and the solder joint seems good, in other cases this empty ball is als

qfp reflow problems

Electronics Forum | Fri Apr 23 13:31:20 EDT 2004 | russ

The toes of leaded devices are problematic in fillet formation. A lot of the time they have the copper from the lead exposed so it becomes oxidized and won't readily take solder. Normally this is of no concern if the heel and side fillets are forme

Re: double sided reflow

Electronics Forum | Thu Jun 22 12:25:07 EDT 2000 | Boca

Jason, What Chrys said! Don't try to run the bottom cooler, tried it in the mid 80's, don't work and don't want it to work. If one side of a fab is maintained cooler than liquidus and the other side into reflow it would have an easy 40C temp diffe

solder question on crystal in DFN style package

Electronics Forum | Mon Apr 05 16:12:16 EDT 2010 | dyoungquist

We are installing via reflow soldering a crystal that has 2 pads, 1 each end. They are flat pads on the bottom of the part with a small area of the pad looping around and up the side of the crystal on the end. Inspection of the cyrstal under a 40X

62/36/2Ag solder paste on imersion silver plated PCBs

Electronics Forum | Tue Apr 09 00:26:46 EDT 2002 | craigj

Are currently investigating a change of solder paste for various reasons and are considering a move from 63/37 to using 2% silver solder paste for increased long term reliabilty of solder joints with gold finish PCBs and to further reduce reflow temp

Blow Holes voids in solder fillet on caps

Electronics Forum | Thu Jun 28 17:05:46 EDT 2012 | davef

Here’s what we seem to know: * There’s a problem with voiding in the solder connections of SMT capacitors * A void is an open area caused by air or process fluid that is trapped within a solder connection * Voids are an allowable condition as long as

Re: white dirty solder

Electronics Forum | Thu Jan 15 15:13:50 EST 1998 | justin medernach

| I have a problem! The solder on my pc boards look great comeing out | of my reflow oven. They go thrue the rest of the prossese | and at the end at the qc station it's cold or whitish or gray not shiny. | does any one have a idea on how to correct

Replacement for nitrogen in the reflow oven

Electronics Forum | Fri May 21 18:32:53 EDT 2004 | Abe Froman

We have been using nitrogen in our reflow ovens for many years to reduce oxidation on our solder joints. Management is concerned about the high cost of nitrogen and have suggested we use hydrogen instead. I'm not sure if this is a good idea, but we

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 16:06:32 EST 2000 | eLDON sANDERS

Gentlemen, I too have been atacked by that "soldering to gold" and will add my 2 cents. I also had parts that would pop off the board when the fillet looked perfect. After lots of pain, experimentation, and sleepless nights, I solved it through a


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