Technical Library | 2014-10-16 16:39:12.0
Key points are: *Long-term storage of BGA & QFP products may be required due to: Fab and assembly factory transfers Product obsolescence requiring customers make lifetime/EOL purchases Providing extended service (10+ years) on vehicles Other program needs * Integrity of EOL products in terms of solderability needs to be verified.
Technical Library | 1999-05-07 08:50:40.0
To enable transistor scaling into the 21st century, new solutions such as high dielectric constaConventional scaling of gate oxide thickness, source/drain extension (SDE), junction depths, and gate lengths have enabled MOS gate dimensions to be reduced from 10mm in the 1970’s to a present day size of 0.1mm. To enable transistor scaling into the 21st century, new solutions such as high dielectric constant materials for gate insulation and shallow, ultra low resistivity junctions need to be developed. In this paper, for the first time, key scaling limits are quantified for MOS transistorsnt materials for gate insulation and shallow, ultra low resistivity junctions need to be developed.
Adhesion Promotion Electronics Coatings Increase the bond strength, eliminate delamination, and improve reliability of difficult to bond substrates. Aculon's non-stick, adhesion promotion and anti-oxidation coatings can be used on a broad range of
General Purpose (SMT and Leaded Styles): Thick Film Chips and Arrays (SMT), NTC Chip Thermistors (SMT), Carbon Film (LD), Metal Film (LD), Metal Oxide Film (LD) and SIP Networks (LD)
New Equipment | Test Equipment
The CALOTEST® is widely used for analyzing coatings with thicknesses of between 0.1 and 50 µm. The simple ball-cratering method is a fast and accurate means of checking the thickness of any coating, whether a single or multilayered stack. Typical exa
New Equipment | Rework & Repair Equipment
The BEST Gold Contact Replating Kit includes the tools you need for fast replating and modification of circuit contacts. Edge contacts may require replating if they are contaminated with solder or become scratched during handling or do not meet the m
Industry News | 2016-01-05 13:57:47.0
Barry Industries announces the introduction of a RoHS-compliant flange mount RF termination, T50R0-500-15X, which dissipates 500W with favorable return loss over a DC to 4.5GHz bandwidth. Barry Industries is an ISO9001:2008 certified ITAR registered manufacturer of high quality thick film resistors, terminations, attenuators and high temperature co-fired ceramic (HTCC) packaging.
Industry News | 2008-03-25 21:12:57.0
GREELEY, CO � March 25, 2008 � FCT Assembly announces the acquisition of a Spark OES Analyzer (Optical Emission Spectroscopy) to its analytical lab, which is located in Greeley, Colo. The OES analyzer is one of the most advanced pieces of equipment of its kind available to the market today. FCTA purchased the state-of-the-art equipment to serve as the primary analyzer for all EMS and PC-Fab customer solder analysis, especially those that are lead-free.
New Equipment | Solder Materials
AuSn solder electroplating is a key technology developed by Micralyne to lower your production costs and give you a better MEMS product. This state-of-the-art, patented process for electroplating AuSn solder alloy is a giant step forward in electropl
New Equipment | Fabrication Services
Based on the special application of PCB, Aluminum base material and Copper base material are used to replace the traditional FR-4 material. Eastech has very mature production and manufacturing experience for PCB based on metal materials. We always br
