Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
Industry Directory | Consultant / Service Provider / Manufacturer
Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD，PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.
New Equipment | Education/Training
In this One-Day class you will learn successful techniques to re-ball BGA Components. Both Lead and Lead Free Solder Balls will be covered. The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the
New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
Electronics Forum | Thu Mar 28 11:06:49 EST 2002 | Tony Fox
Our company carries out this service for major OEM and CEM's Our web site address is http://www.retronix.co.uk Every device after it has been re-tinned gose throught a vision inspection system were it is inspected for coplinarity etc, we also re-ball
Electronics Forum | Tue Apr 20 14:55:19 EDT 2004 | mrmaint
Does anyone out there know of a method to remove oxidation from the balls of a BGA, other than reball. thanks, MRMAINT
Industry News | 2018-10-18 08:17:09.0
How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process
Industry News | 2018-12-18 20:24:14.0
The best technical conference paper of IPC APEX EXPO® 2019 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, January 29, 2019.
Technical Library | 2016-05-26 15:07:36.0
The oxide layers are known as wetting inhibitors in component and PCB metallizations. The oxide acts as barrier that prevent the tin diffusion from happening. Besides, in corrosion studies, the role of salt residues -with Cl ion- on some metals is known as being promoters of oxidation or corrosion. On the other hand, most of corrosion studies with tin metallization are focused mainly on the corrosion resistance of tin alloys, but little has been done respecting to the influence of salts on tin metallization wetting. In this paper, a series of experiments was carried over to know the influence of specifically NaCl on BGA wetting given Head in Pillow (HiP) as result.
Technical Library | 2014-10-16 16:39:12.0
Key points are: *Long-term storage of BGA & QFP products may be required due to: Fab and assembly factory transfers Product obsolescence requiring customers make lifetime/EOL purchases Providing extended service (10+ years) on vehicles Other program needs * Integrity of EOL products in terms of solderability needs to be verified.
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
Dinghua Technology-- the leading manufacturer of BGA rework station, Automatic screw locking machine, Automatic soldering station and non-standard equipment. For more details, please just contact John, WhatsApp/Wechat:+86 1576811 4827 , Skype: si
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | NORTHRIDGE, California USA | Engineering
EDUCATION BS Electronics and Communication Engineering Gujarat University MS Electrical Engineering California State University, Northridge ACADAMIC PROJECT Fabrication and Characterization of Silicon Carbide (SiC) MESFE
SMTnet Express July 18, 2013, Subscribers: 26169, Members: Companies: 13430, Users: 34947 Effect of Surface Oxide on the Melting Behavior of Lead-Free Solder Nanowires and Nanorods by Fan Gao, Karunaharan Rajathurai, Qingzhou Cui, Guangwen Zhou
SMTnet Express, May 26, 2016, Subscribers: 24,776, Companies: 14,803, Users: 40,361 Influence of Salt Residues on BGA Head on Pillow (Hip) J. Servin, P. Gomez, M. Dominguez, A. Aragon; Continental Corporation The oxide layers are known as wetting
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