Industry Directory | Manufacturer
Nett Technologies Inc. is a manufacturer of emission solutions using diesel oxidation catalyst (DOC), diesel particulate filter (DPF), selective catalytic reduction (SCR)system technologies.
Industry Directory | Consultant / Service Provider / Manufacturer
Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD，PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.
New Equipment | Rework & Repair Equipment
The BEST Gold Contact Replating Kit includes the tools you need for fast replating and modification of circuit contacts. Edge contacts may require replating if they are contaminated with solder or become scratched during handling or do not meet the m
We provide ceramic circuits boards in both - Aluminium oxide (Al2O3 96%) or Alumina - Aluminum Nitride - Transparent Alumina Thanks to ceramics'excellent material properties. Ceramics are used more and more in applications where thermal performa
Electronics Forum | Thu Dec 06 15:09:14 EST 2001 | smtspecialist
Thanks for the info, Of course the first thing to do was to look with my supplier, but the problem was that it's a special relay, custom made from a design created 10 years ago. Two years ago that company went BK and we had to order a whole bunch t
Electronics Forum | Wed Dec 12 07:38:04 EST 2001 | smtspecialist
I have observed the same thing with solder composition in this case I am using 63/37 NC which is giving good results usualy. The liquid tin, product from MG Chemical that I used is to tinplates copper circuit on PC boards. I tried on few relays, it
Used SMT Equipment | Soldering Equipment/Fluxes
The MWM 3250 is a modular selective SOLDERING system which may be totally tailored to meet your production requirements. It means: *maximum flexibility with: - different working stations, as for instance fluxer units, solder units, preheat units, t
Used SMT Equipment | Soldering Equipment/Fluxes
The MWM 3250 is a modular selective SOLDERING system which may be totally tailored to meet your production requirements. It means: *maximum flexibility with: - different working stations, as for instance fluxer units, solder units, preheat units, t
Industry News | 2018-10-18 09:25:57.0
about wave soldering machine tin pot
Industry News | 2018-12-18 20:24:14.0
The best technical conference paper of IPC APEX EXPO® 2019 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, January 29, 2019.
Technical Library | 2013-03-28 16:18:22.0
For the last couple of years, the main concerns regarding the electrical performance of blank PCB boards were impedance and ohmic resistance. Just recently, the need to reduce insertion loss came up in discussions with blank board customers (...) The paper describes the test vehicle and the testing methodology and discusses in detail the electrical performance characteristics. The influence of the independent variables on the performance characteristics is presented. Finally the thermal reliability of the boards built applying different copper foils and oxide replacements was investigated.
Technical Library | 2021-12-29 19:52:50.0
Medtronic seeks to quantify the thermal aging limits of electroless Ni-electroless Pd-immersion Au (ENEPIG) surface finishes to determine how aggressive the silicon burn-in process can be without loss of solderability. Silicon burn-in (power testing at elevated temperature) is used to eliminate early field failures, critical for device reliability. Thermal aging due to burn-in or annealing causes Ni and Pd diffusion to and oxidation on the surface. Surface oxides limit wetting of the PbSn solder, affecting electrical connectivity of components soldered afterburn-in. Isothermal aging of two ENEPIG surface finishes was performed at 75°C-150°C for 100 hrs-1500hrs to test the thermal aging limits and identify how loss of solderability occurs.
ITW EAE, the Electronic Assembly Equipment division of ITW is introducing an innovative new twin-nozzle developed by the Vitronics Soltec team for the ZEVA Selective Soldering System. The 3D-Twin-Nozzle™ has two nozzle diameters combined in one
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support
Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.
SMTnet Express July 18, 2013, Subscribers: 26169, Members: Companies: 13430, Users: 34947 Effect of Surface Oxide on the Melting Behavior of Lead-Free Solder Nanowires and Nanorods by Fan Gao, Karunaharan Rajathurai, Qingzhou Cui, Guangwen Zhou
| http://etasmt.com/te_news_industry/2021-09-01/24564.chtml
. Dewetting directly impacts the quality of solder joints. Root Cause Analysis The PCB pads or the component‘s pins are oxidized. An oxidation layer prevents contact between the solder and the surface plating layer
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
). Bridging Formation of a solder alloy connection between two or more adjacent contacts. Bumped Circuit Boards Bare printed circuit boards that have had solder paste deposited and reflowed on the pads prior to component installation
