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PCB Electronics Manufacturing Automation Software for EMS, OEM & ODM manufacturers. Over 3000 customers worldwide!
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
Electronics Forum | Fri Jan 26 09:37:42 EST 2001 | blnorman
Our current solder paste vendor wants us to evaluate a paste. One of the selling points is that this paste (SnPb) will have the same flux package that will be used with some of their lead-free pastes. We are looking at going to SAC when we go lead-
Electronics Forum | Mon Oct 25 14:40:13 EDT 2010 | rgduval
It's pretty much true, every company builds their own package database...usually on an as you go basis, meaning you create packages as you need them. If you bought the machine from MyData, it should have shipped with at least the basic packages in p
Used SMT Equipment | Component Packaging
This item is included in the Auguat 21-24 Online Auction. Please visit the following website for all of the details. http://bajabid.hibid.com/catalog/108607/august-2017-online-auction/?
Used SMT Equipment | Component Packaging
This item is included in the Auguat 21-24 Online Auction. Please visit the following website for all of the details. http://bajabid.hibid.com/catalog/108607/august-2017-online-auction/?
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2021-11-08 14:38:39.0
Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.
Parts & Supplies | Component Packaging
CM402 CM602 Filter Part No:N610071334AA,N210048234AA
Parts & Supplies | Component Packaging
HT121 BM221 Filter Part No;10811100180, 1086209282
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Tue Feb 15 00:00:00 EST 2022 - Thu Feb 17 00:00:00 EST 2022 | San Jose, California USA
Wafer-Level Packaging Symposium
Events Calendar | Wed Feb 14 00:00:00 EST 2024 - Fri Feb 16 00:00:00 EST 2024 | San Francisco, California USA
Wafer-Level Packaging Symposium
Career Center | All, China | Sales/Marketing
Looking for a commission based sales representative to sell SMTnet.com Advertising services in Asia, Europe, USA. The candidate should be familiar with the electronics manufacturing industry. Please view our marketing packages at: http://www.s
Career Center | All, Florida USA | Sales/Marketing
Baja Bid is looking for some good sales representatives. We are prepared to offer some VERY attractive commission packages including regional exclusivity to the right representatives. If you know anyone that would like to discuss this subject in
Career Center | GOBICHETTIPALAYAM, India | Engineering
PCB design, layout and packaging of high-speed, high-density, Mixed Technology Analog / Digital signals & RF signals, Flex, Rigid board, Commercial, Application Boards, based on client requirement and Quality Inspection of the design.
Career Center | Bangalore, India | Engineering,Management,Production,Quality Control,Technical Support
WORK EXPERIENCE DETAILS: 7+ Years of Experience in manufacturing & hardware testing of Protocol conveter & Commissioning, Products delivery and QA/QC. 2+ Years of Experience in Hardware testing and Package Level testing. 2+ Years of Experience in
QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/k3031m-maintenance-package-181757?page=66&category=1145
FUJI Maintenance package K3031M | QYSMT × Home about Us ABOUT US FAQ SMT spare parts SMT surplus equipment SMT peripheral equipments News Contact US 0 0 Sign in contact us Products Others SMT parts Maintenance package Public Pricelist Public
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/markets-and-industries/case-and-package-assembly
Case & Package Assembly | Nordson ASYMTEK ASYMTEK Products Corporate | Global Directory | Languages Division Only All of Nordson Fluid Dispensing Systems Jets
