Industry Directory | Consultant / Service Provider
PCB Electronics Manufacturing Automation Software for EMS, OEM & ODM manufacturers. Over 3000 customers worldwide!
Industry Directory | Consultant / Service Provider / Manufacturer
We give you more options with no static. CCI has been an industry leader in high-performance, custom static safe packaging for 30+ years. Simply put, we design the best electro-static discharge protective packaging in the world.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
Used SMT Equipment | Chipshooters / Chip Mounters
sFAB-D machines have continued to evolve since their release to the market. They are able to insert parts into various panels with a wide range of support in part packaging. As an entry model, sFAB-SH machines are now added into the same product line
Used SMT Equipment | AOI / Automated Optical Inspection
3D Wafer Bump &Wire Bonding AOI Inspection system Highest quality 3D Wire-Inspection. With high-resolution, complete inspection is possible even for Foot-shape. Inspect Mirror-surface without Reflection problem. As for PEMTRON'S unique optical techn
Industry News | 2003-04-03 08:51:07.0
Symphony 3070TM Package from JTAG Technologies for Testing and In-System Flash / PLD Programming
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Technical Library | 2022-12-23 20:44:54.0
One of the upcoming reliability issues which is related to the lead-free solder introduction, are the headin-pillow solderability problems, mainly for BGA packages. These problems are due to excessive package warpage at reflow temperature. Both convex and concave warpage at reflow temperature can lead to the head-in-pillow problem where the solder paste and solder ball are in mechanical contact but not forming one uniform joint. With the thermo-Moiré profile measurements, this paper explains for two flex BGA packages the head-in-pillow. Both local and global height differences higher than 100 µm have been measured at solder reflow temperature. This can be sufficient to have no contact between the molten solder ball and solder paste. Finally, the impact of package drying is measured
Technical Library | 1999-05-06 10:46:06.0
Pentium-class portables present significant packaging problems. The heat generated inside a notebook not only reduces microprocessor reliability, but the reliability of peripheries such as hard drives and video chips. Although the processor is the primary heat-generating source, it isn’t always the component least tolerant of temperature...
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
EZReball demonstration video. Simple and Fast new reball method! The new BEST EZReball™ process is an answer to your reballing problems. This unique method simplifies the reballing process allowing for better yields and faster reballing times. http:
Training Courses | ON DEMAND | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Training Courses | ON DEMAND | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Wed Apr 07 18:30:00 UTC 2021 - Wed Apr 07 18:30:00 UTC 2021 | ,
Webinar: The IPC Digital Twin Standard
Career Center | San Jose, California USA | Engineering,Research and Development
Advanced Packaging Engineer � Develop advanced packaging technologies and processes, including: wafer thinning and dicing; die attach; wire bonding; overmolding; singulation � Perform Design of Experiments to establish optimized process windows for
Career Center | , Maryland USA | Engineering
Late stage start-up company, well into commercialization, that develops and manufactures products to precisely control the instantaneous release of heat energy for reaction initiation and joining applications. Actively participate in the developmen
Career Center | Round Rock, Texas USA | Engineering,Maintenance,Production
Seasoned Field Service Engineer with 14 years experience in the electronic manufacturing and semiconductor package industries. A proven record of accomplishment in identifying problems and implementing innovative solutions. Skilled at promoting,
Career Center | Boise, Idaho USA | Engineering,Research and Development
Sr. Microelectronics Development Engineer Over 20 years experience in SMT Process Development for large Contract Manufacturer. Specialist in Stencil Printing, Component Placement, Dispense, Reflow, Rework, RoHS Processes, Material and Equipment Quali
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/extended-sop-package-name_topic1103_post4316.html
Extended SOP Package Name - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login Extended SOP Package Name
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/industries/packaging?con=t&page=11
Nordson hot melt adhesive application and verification systems for package sealing & labeling Adhesive Dispensing Systems Corporate | Global Directory
