We are a full-service, contract packager that utilizes a combination of manual and semi-automated processes to package a wide range of consumer goods. Our packaging capabilities include assembly, shrink wrapping,and flow wrapping.
Industry Directory | Manufacturer
We guarentee to lower your product cost! With over 15 years experience, we are DIRECT CONTACTS of select Asian manufacturing companies and factories from The People's Republic of China, Philippines, and Hong Kong. This select group is well-established manufacturing experts within their industries. We have long term relations with each
New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
Electronics Forum | Tue Apr 06 17:01:24 EDT 2004 | davef
It doesn't make sense that contamination would form on your gold pads after prebake of 150C for 3 hrs. The contamination must have been there prior to the bake. Your description makes us think of solder mask bleed. Tell us about: * Solder mask * S
Electronics Forum | Wed Apr 07 22:15:31 EDT 2004 | davef
We're not familiar with the AUG5 from Taiyo. [It doesn't show on their US site.] Is it liquid photoimageable? Printed solder masks are more likely to bleed. But you wouldn't have any solderability with bleed. Your plating seems acceptable [if th
Used SMT Equipment | General Purpose Equipment
Very nice Tyco Press For Sale Tyco Model: AEP-12T Year 2007 Windows XP 12 Tons Board Capacity: 36 x 48" PC controlled servo electric press for fine control of speed, force and height up to 12 tons [107 kN] of pressing capacity Monitors inse
Used SMT Equipment | In-Circuit Testers
Agilent HP 3070 In Circuit Test System For Sale The system came off line in good running condition! Machine is complete with keyboard, mouse, and all cable connections Please see attached pictures and configuration below copied from file !!!! 5 0 2 1
Industry News | 2011-01-20 12:39:04.0
MIRTEC, "The Global Leader in Inspection Technology," appoints ARK Manufacturing Solutions, LLC as its manufacturers’ representative for Arizona.
Industry News | 2011-11-03 21:52:00.0
By davef: I was fortunate to be able to attend the SMTAI Exhibition Oct. 18-19, 2011. While I was walking around looking at the booths and talking to the exhibitors, I got this idea that I would report back on things that I found interesting. You know spread the news, since not everyone was there.
Parts & Supplies | Component Packaging
Supply Sony E/F/G series ENCODER, ROTARY(RE93-1024T06) part number:1-479-340-11 zoey@jinchensmt.com
Parts & Supplies | Component Packaging
JUKI SMT Feeder E Ring New Compatible Metal Part No RE0200000K0 Specifications 1. E Ring 2. Part No: RE0200000K0 3. For JUKI Feeder 4. 1 year warranty 5. Lead time: in stock E1105706000 POLY SLIDER 1 E1304706CB0A EEL HOUSING ASM. 1 E131
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 1999-05-06 11:18:25.0
The trend toward surface-mount assembly processes is making ball-grid array (BGA) packaging a popular choice for many types of devices, forcing designers to re-examine cooling of these large packages. While devices in BGAs transfer more heat to the board than leaded devices, the style of BGA packages has a large influence on the ability to transfer heat through other pathways, such as a top-mounted heat sink. Physical characteristics of the BGA further constrain the thermal designer. It takes forethought in board design to successfully accommodate devices that require significant heat dissipation. Multiple solutions exist, however, for BGA packages of all types.
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Tue Mar 26 00:00:00 EDT 2024 - Tue Mar 26 00:00:00 EDT 2024 | Taoyuan City,
SMTA Taiwan Tech Forum 2024
Events Calendar | Wed Aug 21 00:00:00 EDT 2024 - Wed Aug 21 00:00:00 EDT 2024 | Kaohsiung City, Taiwan
Taiwan Alliance LTS Workshop
Career Center | , Massachusetts USA | Engineering,Production
Are your tired of hearing about looming layoffs, dot.bombs and constantly financial instability? If you posess at least 3 or more years of experience in testing optical components and interfacing directly with customers - this is your lift ticket ou
Career Center | Strongsville, Ohio USA | Accounting/Finance,Clerical,Engineering,Management,Production,Purchasing,Quality Control,Research and Development,Sales/Marketing,Technical Support
Spartronics is more than just a company. We have great facilities, a dedicated and talented team, tremendous capacity and capabilities, and longstanding customers who need us. Now, it’s all about driving forward with a winning strategy that bui
Career Center | nagercoil, India | Maintenance,Production
3.5 year's experience in smt. Am looking for a growth orinted organization .
Career Center | Kitchener, Ontario Canada | Engineering,Maintenance,Technical Support
Knowledgeable in Design of Experiments (DOE), Design for Manufacturability (DFM), Statistical Process Control (SPC), Failure Mode & Effects Analysis (FMEA) and Root Cause Analysis that drives continuous improvement in package reliability. A recogniz
GPD Global | https://www.gpd-global.com/pdf/lead-former/CF9-Doc-Package-901-1-01.pdf
CF9 Documentation Package Documentation Package for CF-9 Taped Radial Component Lead Former PN 901-1-01 CONTENTS of CF-9 Documentation Package Operating Guide In addition to installation, set up, and
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_recommented-dimension_topic2363.xml
: Hi,I have used re-commented dimension... Author: LAKSHMANANKSSubject: 2363Posted: 19 Jul 2018 at 6:41amHi,I have used re-commented dimension for QFN package
