Industry News | 2010-09-27 23:01:06.0
Christopher Associates/Koki Solder announces that Jasbir Bath will present a paper titled “An Investigation into the Development of Lead-Free Solder Paste for Package on Package (PoP) Component Manufacturing Applications” at the upcoming SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2018-08-16 19:42:31.0
Anda Technologies USA, Inc., a leading provider of fluid application and custom design manufacturing equipment, features a line of precision high-performance fluid dispensing and underfill systems. iJet-Table Dispenser Models 250 & 350 are useful for many applications such as SMT and PCB packaging, underfill, semiconductor packaging, LED packaging, electromechanical assembly, as well as flat panel assembly. The machines boast a max speed of 600 mm/second and 0.02 mm precision and repeatability.
Industry News | 2019-10-26 15:15:20.0
Laserssel Co., LTD announces that it was awarded two 2019 Mexico Technology Awards in the categories of Soldering Equipment – Laser for its LSR (Laser Selective Reflow) and Bonding for its cLSR. The awards were presented to the company during a Wednesday, October 23, 2019 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.
Industry News | 2019-11-13 12:32:13.0
Laserssel Co., LTD announces that it was awarded a 2019 Global Technology Award in the category of Soldering – Selective for its LSR (Laser Selective Reflow). The award was presented to the company during a Tuesday, Nov. 12, 2019 ceremony that took place during productronica in Munich, Germany
Industry News | 2014-10-14 19:36:17.0
Akrometrix LLC will present and exhibit at the 36th International Electronics Manufacturing Technology Conference (IEMT), scheduled to take place November 11-13, 2014 at the Renaissance Johor Bahru Hotel in Johor, Malaysia.
Industry News | 2014-02-20 10:36:06.0
ViTrox Technologies will debut the new V510 Optimus 3D AOI system in booth #717 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.
Industry News | 2018-06-17 16:55:59.0
SHENMAO America, Inc. is pleased to introduce its PQ10 Low Temperature Solder Paste. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon.
Industry News | 2023-10-23 09:52:43.0
TopLine's CCGA Column Grid Array IC packages and large Ball Grid Array (BGA) package solutions will highlight the company's exhibit at Productronica 2023. TopLine will exhibit in Hall A4.460, and the solutions offered by TopLine will include Bonding Wire, CCGA solder columns, IC Chip Trays, Daisy Chain Dummy Components, and PCB Jumpers.
Industry News | 2015-07-01 14:55:55.0
Akrometrix is pleased to announce that Mayson Brooks has joined the company as President & CEO, effective July 6, 2015. Mr. Brooks brings significant experience in semiconductor inspection and metrology for both front and back-end applications, especially in advanced packaging, which is an excellent fit for the strategic direction of Akrometrix.
Industry News | 2018-07-08 18:45:56.0
SHENMAO America, Inc. today announced plans to exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, July 12, 2018 at the Embassy Suites Cleveland Rockside. Company representatives will showcase the new PQ10 Low Temperature Solder Paste.
