Industry News | 2017-06-29 18:37:43.0
Akrometrix is pleased to announce that it has launched its newest warpage metrology system – the Tabletop Shadow Moiré (TTSM) system.
Industry News | 2017-08-14 18:57:16.0
Akrometrix will display its newest warpage metrology system in Booth #124 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. The new Tabletop Shadow Moiré (TTSM) system responds to the industry’s demand for an ultra-fast tabletop warpage metrology system.
Industry News | 2016-04-29 12:00:45.0
Akrometrix today announced that the company has shipped its 300th shadow moiré metrology system to a leading back-end company in South Korea.
Industry News | 2016-05-05 20:15:12.0
Akrometrix today announced that the company released its next-generation Convection Reflow Emulation Module (CRE6) for warpage metrology.
Industry News | 2016-10-04 19:28:47.0
Akrometrix today announced its next-generation Shadow Moiré System – the AXP 2.0.
Industry News | 2011-01-05 17:46:58.0
Practical Components Inc. announced the availability of daisy chain samples of Amkor Technology, Inc.’s TMV® PoP (Package on Package) solution.
Industry News | 2014-04-02 14:06:24.0
Microtronic GmbHnow offers Akrometrix LLC’s CXP, the latest surface measurement equipment platform powered by Studio Software.
Industry News | 2019-01-10 16:30:44.0
NP505-LT is a no-clean, lead-free, zero-halogen solder paste for assemblies that have temperature sensitive substrates and components.
Industry News | 2016-09-23 15:41:59.0
Akrometrix today announced that Ryan Curry, Technical Account Manager, will co-present a paper with Don Adams, Manufacturing Engineering Manager at Bose Corporation, during SMTA International. The presentation, “Understanding PCB Design and Material Warpage Challenges Which Occur during B2B/Module-Carrier Attachment,” is scheduled to take place during session APT7, “Package and PCB Interactions,” on Wednesday, September 28th at 4 p.m.
Industry News | 2023-03-16 14:42:07.0
SHENMAO America, Inc. has released its new Anti-HoP Lead-Free Solder Paste PF606-P130N. The paste is specially designed for the SMT process to prevent head-on-pillow (HoP) issues.
