Technical Library | 2020-09-23 21:37:25.0
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower process temperatures. For soldering processes the only way that temperatures can be substantially reduced is by using solders with lower melting points. Because of constraints of toxicity, cost and performance, the number of alloys that can be used for electronics assembly is limited and the best prospects appear to be those based around the eutectic in the Bi-Sn system, which has a melting point of about 139°C. Experience so far indicates that such Bi-Sn alloys do not have the mechanical properties and microstructural stability necessary to deliver the reliability required for the mounting of BGA packages. Options for improving mechanical properties with alloying additions that do not also push the process temperature back over 200°C are limited. An alternative approach that maintains a low process temperature is to form a hybrid joint with a conventional solder ball reflowed with a Bi-Sn alloy paste. During reflow there is mixing of the ball and paste alloys but it has been found that to achieve the best reliability a proportion of the ball alloy has to be retained in the joint, particular in the part of the joint that is subjected to maximum shear stress in service, which is usually the area near the component side. The challenge is then to find a reproducible method for controlling the fraction of the joint thickness that remains as the original solder ball alloy. Empirical evidence indicates that for a particular combination of ball and paste alloys and reflow temperature the extent to which the ball alloy is consumed by mixing with the paste alloy is dependent on the volume of paste deposited on the pad. If this promising method of achieving lower process temperatures is to be implemented in mass production without compromising reliability it would be necessary to have a method of ensuring the optimum proportion of ball alloy left in the joint after reflow can be consistently maintained. In this paper the author explains how the volume of low melting point alloy paste that delivers the optimum proportion of retained ball alloy for a particular reflow temperature can be determined by reference to the phase diagrams of the ball and paste alloys. The example presented is based on the equilibrium phase diagram of the binary Bi-Sn system but the method could be applied to any combination of ball and paste alloys for which at least a partial phase diagram is available or could be easily determined.
Industry News | 2021-11-03 13:33:10.0
Laserssel Co., LTD is pleased to announce that it received two 2021 Mexico Technology Awards in the categories of Bonding Equipment for its LCB 3000 Laser Compression Bonder and Rework & Repair for its Laserssel rLSR Mini LED Rework System. The awards were announced during a ceremony that took place Wednesday, Nov. 3, 2021 during SMTA International in Minneapolis, MN.
Jet printing for high mix production The MY500 Jet Printer is a breakthrough innovation. Well proven on five continents, it shoots solder paste on the fly at split-second speeds while moving above the board. The MY500 is designed to keep pace with
Industry News | 2021-02-12 16:08:40.0
Nihon Superior Co. Ltd is pleased to announce thatit will exhibit its newly developed TempSave series during the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. The company also will showcase its NozzleSave alloyalong with SN100CV P608 and LF-C2 P608 solder pastes.
Industry News | 2021-10-07 15:29:25.0
Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #3301 at the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. The company also will showcase SN100CV P608 solder paste.
Industry News | 2022-01-03 07:24:21.0
Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its newly developed TempSave series during the 2022 IPC APEX Virtual EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center, San Diego, CA. The company also will showcase its TipSave N alloy along with SN100CV P608 and LF-C2 P608 solder pastes.
Industry News | 2022-10-06 18:19:54.0
Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #1230 at the SMTA International Exposition, scheduled to take place Nov. 2-3, 2022 at the Minneapolis Convention Center in Minneapolis, MN. The company also will showcase SN100CV P608 solder paste.
Industry News | 2022-12-21 10:42:04.0
Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #1433 at the IPC APEX Exposition, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in San Diego, CA. The company also will showcase LF-C2 P608 solder paste.
Industry News | 2023-09-11 17:19:08.0
Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its SN100CV P608 solder paste in Booth #1415 at the SMTA International Exposition, scheduled to take place Oct. 10-11, 2023 at the Minneapolis Convention Center in Minneapolis, MN.
Industry News | 2024-03-18 12:19:32.0
Nihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Booth 1325 during the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. Renowned for its commitment to innovation, Nihon Superior will present a range of groundbreaking products, including the SN100CV® P608 solder paste and the TempSave™ series of low-temperature soldering materials.
