Full Site - : package warpage (Page 9 of 22)

Akrometrix LLC Will Discuss Thermal Warpage and Strain Metrology at APEX

Industry News | 2016-02-17 16:31:00.0

Akrometrix LLC will exhibit in Booth #1623 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Company representatives will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. Akrometrix also will demonstrate its new Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.

Akrometrix

PAC Global to Discuss Thermal Warpage and Strain Metrology Solutions from Akrometrix at Upcoming SMTA Expos

Industry News | 2016-02-18 19:59:51.0

Akrometrix will exhibit at the SMTA Houston & Dallas Expo & Tech Forums in Texas. SMTA Houston is scheduled to take place Tuesday, March 1, 2016 at the Stafford Centre and SMTA Dallas is scheduled to take place Thursday, March 3, 2016 at the Plano Centre. The PAC Global team will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. PAC Global also will demonstrate the new Akrometrix Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.

Akrometrix

Laserssel Appoints Kurt Whitlock Associates as Newest Rep

Industry News | 2019-08-20 16:43:50.0

Laserssel has announced their newest rep appointment of Mike Holleran of Kurt Whitlock Associates, who will cover all of Florida.

Laserssel Corporation

Laserssel Appoints SW Systems Technology

Industry News | 2019-08-20 16:46:07.0

Laserssel has announced SW Systems Technology as its representative for Southwest US and Mexico.

Laserssel Corporation

Laserssel to Highlight Advanced LSR Technology at SMTAI 2019

Industry News | 2019-09-04 14:40:11.0

Laserssel has announced they will exhibit in booth #1109 at SMTA International, scheduled to take place September 24-25, 2019 at the Donald Stephens Convention Center in Rosemont, IL.

Laserssel Corporation

Laserssel to Highlight Advanced LSR Technology at SMTA Guadalajara 2019

Industry News | 2019-09-23 16:15:55.0

Laserssel has today announced they will exhibit in booth #611 at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place October 23-24, 2019 at the Expo Guadalajara in Guadalajara, Mexico.

Laserssel Corporation

This animation shows the overview of programming and running of a MYDATA MY500 Jet Printing machine.

This animation shows the overview of programming and running of a MYDATA MY500 Jet Printing machine.

Videos

This animation shows the overview of programming and running of a MYDATA MY500 Jet Printing machine. Check the ''Jet Printing in detail'' video to see how Jet Printing works

Mycronic Technologies AB

Indium Corporation to Feature High-Reliability Materials for Power Electronics at NEPCON Japan

Industry News | 2024-01-29 11:33:44.0

Indium Corporation® is proud to showcase its proven advanced assembly materials for power electronics, including the rapidly evolving electric vehicle (EV) manufacturing and e-Mobility market, at NEPCON Japan, January 24-26, in Tokyo, Japan. Indium Corporation's products for power electronics have been demonstrated to reduce energy consumption and solve warpage issues for its customers while ensuring high reliability and improving overall efficiency.

Indium Corporation

Indium Corporation to Feature Products for HIA and SiP at IMAPS Boston

Industry News | 2022-09-19 05:59:24.0

Indium Corporation® will feature innovative material solutions designed to meet the evolving challenges of SiP and HIA at the 55th International Symposium on Microelectronics (IMAPS) from Oct. 3-6 in Boston, Mass., U.S.

Indium Corporation

Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology

Technical Library | 2021-01-13 21:34:29.0

Package-on-Package (PoP) is a popular technology for fabricating chipsets of accelerated processing units. However, the coefficient of thermal expansion mismatch between Si chips and polymer substrates induces thermal warpage during the reflow process. As such, the reflow temperature and reliability of solder joints are critical aspects of PoP. Although Sne58Bi is a good candidate for low-temperature processes, its brittleness causes other reliability issues. In this study, an in-situ observation was performed on composite solders (CSs) made of ...

Osaka University


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