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ECA, Inc. Partners with MIRTEC for Continuous Quality Improvement

Industry News | 2020-10-03 08:34:38.0

MIRTEC is pleased to announce that Energy Conversion Applications (ECA), Inc., a full-service EMS provider specializing a full range of turnkey and hybrid solutions for PCB assembly including custom cables & harness, coil winding and complete box build assembly, has selected MIRTEC as their AOI partner with the purchase of an MV-3L Desktop AOI Machine.

MIRTEC Corp

MIRTEC Receives Award for MV-9 SiP HYBRID 3D AOI Technology

Industry News | 2021-11-05 07:31:03.0

MIRTEC is pleased to announce that it received a 2021 Mexico Technology Award for its revolutionary MV-9 SiP HYBRID 3D AOI system. The award was announced during a ceremony that took place Wednesday, Nov. 3, 2021 during SMTA International in Minneapolis, MN.

MIRTEC Corp

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Innovex, Inc. Files Registration Statement for Public Offering of Common Stock

Industry News | 2003-07-09 08:49:20.0

Proposed offering of 3,000,000 shares of its common stock.

SMTnet

MIRTEC Receives 2008 Advanced Packaging Award for Their MV-7L In-Line AOI Machine

Industry News | 2008-07-19 15:38:37.0

OXFORD, CT � July 16, 2008 � MIRTEC, the global leader in Automated Optical Inspection Technology, announces that its MV-7L In-Line AOI System was named First Finalist in the category of Inspection Equipment & Services during the Advanced Packaging Award ceremony that took place on Wednesday, July 16, 2008 at the St. Regis Hotel Conservatory during the SEMICON West exhibition in San Francisco.

MIRTEC Corp

Merix Corporation Updates Guidance for the Third Quarter of Fiscal 2003

Industry News | 2003-01-31 09:39:08.0

Expected to be Below the Guidance Provided During the Company's Earnings Conference Call on December 18, 2002

SMTnet

MIRTEC Receives GLOBAL Technology Award for MV-9 SiP HYBRID 3D AOI

Industry News | 2021-11-22 07:27:39.0

MIRTEC is pleased to announce that it received a 2021 GLOBAL Technology Award in the category of Inspection – AOI systems for its MV-9 SiP HYBRID 3D AOI system. The award was announced during a ceremony that took place Tuesday, Nov. 16, 2021 during productronica in Munich, Germany.

MIRTEC Corp

California Micro Devices Announces Enhanced EMI Filtering with ESD Protection for GSM Handsets

Industry News | 2003-02-25 09:10:01.0

The CSPEMI400 complements California Micro Devices' broad portfolio of CSP (chip scale package) devices for stand-alone ESD protection and EMI filter arrays with ESD protection, making it the most extensive in the industry.

SMTnet

Low-Cost UNIX- and PC-Based Boundary-Scan Upgrade for Agilent 3070 In-Circuit Testers

Industry News | 2003-04-03 08:51:07.0

Symphony 3070TM Package from JTAG Technologies for Testing and In-System Flash / PLD Programming

SMTnet

Legacy Electronics Receives U.S. Patent for 3-D Memory Module with Canopy-type Carriers

Industry News | 2003-05-30 08:26:20.0

The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.

SMTnet


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