Full Site - : pad adhesion strength (Page 10 of 102)

Effect on Microwave Plasma Surface Treatment for Improved Adhesion Strenght of Direct Copper Plating on Polytetrafluoroethylene (PTFE)

Technical Library | 2016-01-07 19:13:23.0

The purpose of this study is to investigate the effect of plasma surface modification to improve adhesion strength between polytetrafluoroethylene (PTFE) and electroless copper plating. PTFE is widely used in many industries because of its unique electrical, thermal, and mechanical characteristics. However, because of its low surface energy, it is difficult to acquire enough adhesion strength between PTFE and other substances without surface modification. Plasma is well known as one of the surface modification techniques that improve adhesion strength.

Nissin Corporation

Self Adhesive Flange Discs

Self Adhesive Flange Discs

New Equipment | Components

Our Self Adhesive Flange Discs or 'Adhesive Flange Protectors' as they are also known, are manufactured from a soft yet flexible 70 Shore Neoprene Rubber which carries a number of resistive properties against Petrol, Acids, Alkali's

Vital Parts ltd

Conductive Adhesive Film,Electrically Conductive Film Adhesive Epoxy, Electrically Conductive Tapes & Films

Conductive Adhesive Film,Electrically Conductive Film Adhesive Epoxy, Electrically Conductive Tapes & Films

New Equipment | Materials

Conductive Adhesive Film    CAF-TD200,CAF-TD300  Product Characteristics:  1.Low moisture absorption  2.High reliability and conductivity  3.Excellent heat resistance  4.Long shelf-life  5.Good peel strength  6.Good binding force with PI and SUS  7.M

Yancheng Tiandi Insulation Co.,Ltd

Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth

Technical Library | 2022-01-26 15:22:33.0

Reliability of conformal coatings used to mitigate tin whisker growth depends on their ability to contain tin whiskers. Two key material properties required to assess the reliability of a polyurethane coating are documented experimentally: adhesion strength and puncture strength. A modified blister test using a predefined blister area is employed to assess the adhesion strength and a puncture test is employed to evaluate the puncture strength of the coating. After measuring the properties at time zero, the coatings are subjected to accelerated testing conditions (high temperature/humidity storage and temperature cycling) and the degradations of the coating properties are documented.

CALCE Center for Advanced Life Cycle Engineering

SMT 256EP

SMT 256EP

Videos

SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical and

YINCAE Advanced Materials, LLC.

Study on Solder Joint Reliability of Fine Pitch CSP

Technical Library | 2015-12-31 15:19:28.0

Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.

Flex (Flextronics International)

ALPHA® Epibond® Surface Mount Adhesives

ALPHA® Epibond® Surface Mount Adhesives

New Equipment | Solder Materials

Epibond® 7275-Series Surface Mount Adhesives are designed for holding in place bottom side – and some mixed technology – surface mount components during the wave soldering process. Epibond®are high-quality non-slumping and non-stringing surface mount

MacDermid Alpha Electronics Solutions

SMT Red Glue

SMT Red Glue

New Equipment | Solder Materials

Product name: SMT Adhesive - AR Series Adhesive Brand: Dyfenco Origin: Taiwan Feature: - Stable adhesive strength - Fast heat cure - Strong tack - Wide processing window - Excellent electrical characteristics ________________________________

Dyfenco International Co., Ltd.

TGP 110 Thermal Conductive Adhesives

TGP 110 Thermal Conductive Adhesives

New Equipment | Materials

Our TGP110 thermal conductive adhesives is a series of reactive thermal grease with very thin BLT that eliminates micro-bubbles at the rough interface when applied. In service time, it can be cured to form thermal gel or thermal pad but with the perf

YINCAE Advanced Materials, LLC.

SP02-TU Single Pin Adhesive Stamping Tool

SP02-TU Single Pin Adhesive Stamping Tool

New Equipment | Assembly Services

Stamping tools are also called as transfer or printing tools, the tools pick up adhesive paste from a tray and stamps the adhesive paste down on to the target pad. Adhesive stamping tools come in various design such as single dot, sta

Vimic Electronic Corporation


pad adhesion strength searches for Companies, Equipment, Machines, Suppliers & Information

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Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.