Industry Directory: pad adhesion test (47)

New SMT Equipment: pad adhesion test (116)

Peel Back Force Tester (PBFT)

Peel Back Force Tester (PBFT)

New Equipment | Pick & Place

Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble

GPD Global

Thermal Transfer, Thermal Interface Materials

Thermal Transfer, Thermal Interface Materials

New Equipment | Materials

We are well versed in the following thermal application materials:     Sil-Pad thermally conductive insulators     Gap-Pad thermally conductive gap filling material     Q-Pad thermal grease replacement film     Bond-Ply thermally conductive adh

ORION Industries

Electronics Forum: pad adhesion test (918)

Coating adhesion problems

Electronics Forum | Fri Sep 24 20:02:39 EDT 2004 | pabloquintana

OK, We have tested and changed several things in our process, but we still getting the same result. We are trying another type of coating. We will see later. My question now is what is adhesion wise acceptable in the industry. I know many of you wi

Coating adhesion problems

Electronics Forum | Sat Sep 25 08:59:59 EDT 2004 | davef

IPC-HDBK-830, Guidelines for Design, Selection and Application of Conformal Coatings says: A conformal coating may have several functions depending on the type of application. The most common are: * Inhibit current leakage and short circuit due to h

Used SMT Equipment: pad adhesion test (49)

Juki KD - 775 JUKI chip mounter

Juki KD - 775 JUKI chip mounter

Used SMT Equipment | SMT Equipment

Product name: KD - 775 JUKI chip mounter Product number: KD - 775 Products in detail JUKI KD775 high-speed daub glue standard equipped with three dispensing head, achieved 0.1 seconds/launch daub adhesive at a high speed. Stable quality stand

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Takaya APT9411CE 2010

Takaya APT9411CE 2010

Used SMT Equipment | In-Circuit Testers

Description Make: Takaya Model: APT-9411CE Year: 2010 Type: Flying Probe   Details:   Takaya APT 9411 CE  Flying Probe The APT-9411CE is designed for users who are looking for a precise and reliable test system with an easy to use softwar

Parker SMT

Industry News: pad adhesion test (819)

GPD Global's PCD Technology Is Proven Compatible with Silver-filled Electrical and Thermal Epoxies

Industry News | 2010-12-07 14:53:07.0

GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.

GPD Global

GPD Global Live Demos at IPC APEX in Las Vegas Convention Center

Industry News | 2016-02-27 22:07:08.0

GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.

GPD Global

Parts & Supplies: pad adhesion test (117)

Juki  KD-2077 high speed glue machine

Juki KD-2077 high speed glue machine

Parts & Supplies | Pick and Place/Feeders

Base size Max 410 × 360mm Min 50 × 30mm Smudge speed 0.1 seconds / launch(best conditions) Smudge accuracy ± 0.15 mm Needle type 30cc Set the smear angle 0 ° ~ 359 °(1 ° unit) A redesigned dot head. The standard

KingFei SMT Tech

Juki SMT process flow

Juki SMT process flow

Parts & Supplies | Pick and Place/Feeders

SMT basic process components include: silk screen (or dispensing), placement (curing), reflow soldering, cleaning, testing, repair     1, silk screen: its role is to paste or patch solder paste printed on the PCB pad, the components f

ZK Electronic Technology Co., Limited

Technical Library: pad adhesion test (43)

Small Volume Solder Paste Dispensing for Aerospace and Defense

Technical Library | 2023-09-07 14:38:31.0

A repeat customer specializing in high-technology interconnect, sensor, and antenna solutions, partnered with us to dispense small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors – gold pads 0.175mm x 0.225mm. We performed a test requiring 0.200mm diameter or smaller dots to demonstrate the dispensing capability required.

GPD Global

StencilQuick™ Lead-Free Solder Paste Rework Study

Technical Library | 2007-01-31 15:17:04.0

The goal of this project is to evaluate the reliability of lead-free BGA solder joints with a variety of different pad sizes using several different BGA rework methods. These methods included BGAs reworked with both flux only and solder paste attachment techniques and with or without the use of the BEST stay in place StencilQuick™. The daisy chained test boards were placed into a thermal test chamber and cycled between -25ºC to 125ºC over a 30 minute cycle with a 30 minute dwell on each end of the cycle. Each BGA on the board was wired and the continuity assessed during the 1000 cycles the test samples were in the chamber.

BEST Inc.

Videos: pad adhesion test (48)

Peel Back Tester

Peel Back Tester

Videos

Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble

GPD Global

Example of how to import CAD data and BOM files, and export setup files for ATE, flying probe ATE and design 'bed of nails' fixturing.

Example of how to import CAD data and BOM files, and export setup files for ATE, flying probe ATE and design 'bed of nails' fixturing.

Videos

www.unisoft-cim.com/pcbtest.htm - In minutes the Unisoft ProntoTEST-FIXTURE software translates CAD & BOM files into real reference designators, netlists, X/Y component pin geometries, values, tolerances, part numbers, etc. This data is used by Test

UNISOFT Corporation

Training Courses: pad adhesion test (4)

IPC-A-600 Acceptability of Printed Boards Training and Certification Program

Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)

The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.

PIEK International Education Centre

IPC-7711/7721 Trainer (CIT) Certification Training Course

Training Courses | | | IPC-7711/7721 Trainer (CIT)

The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.

BEST IPC Training

Events Calendar: pad adhesion test (16)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Practical Set-Up, Qualification of Cleaning Process in PCB Assembly

Events Calendar | Mon Jun 08 00:00:00 EDT 2020 - Mon Jun 08 00:00:00 EDT 2020 | ,

Practical Set-Up, Qualification of Cleaning Process in PCB Assembly

Surface Mount Technology Association (SMTA)

Career Center - Jobs: pad adhesion test (10)

SMT Process Engineer

Career Center | Lincoln, Nebraska USA | Engineering

Brief Description of Job Duties: Provide new program engineering support with emphasis on technical SMT process development. Key activities would include recommendations and implementation of components, SMT pad design, solder methods, testing and r

Molex, Incorporated

SMT Process Engineer

Career Center | Lincoln, Nebraska USA | Engineering

Provide new program engineering support with emphasis on technical SMT process development. Key activities would include recommendations and implementation of components, SMT pad design, solder methods, testing and reliability for both rigid and foi

Molex, Incorporated

Career Center - Resumes: pad adhesion test (10)

CAD CAM (SMT Stencil Design) Engr &Team leader

Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support

SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.

PCB Layout Designer

Career Center | Coimbatore, Tennessee India | 2017-06-05 07:55:08.0

Engineering

Express Newsletter: pad adhesion test (900)

SMTnet Express - August 13, 2015

SMTnet Express, August 13, 2015, Subscribers: 23,186, Members: Companies: 14,558 , Users: 38,745 Pad Cratering Susceptibility Testing with Acoustic Emission Wong Boon San, Julie Silk; Agilent Technologies | Richard Nordstrom, Ph.D.; Acoustic

Anisotropic Conductive Adhesive Bonding - A high-quality Interconnection Technique

Anisotropic Conductive Adhesive Bonding - A high-quality Interconnection Technique Anisotropic Conductive Adhesive Bonding - A high-quality Interconnection Technique Anisotropic Conductive Adhesive Bonding is an interconnection technique mostly

Partner Websites: pad adhesion test (3926)

Flexural test

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/flexural-test

Flexural test X-Ray Inspection and Test Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Bondtesting Systems Micro Materials Testing Wafer Inspection and Metrology X-ray Inspection Systems X-ray Counting Systems Applications Battery

ASYMTEK Products | Nordson Electronics Solutions

Pad to Pad vs Pad to Thermal Tab - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/pad-to-pad-vs-pad-to-thermal-tab_topic3075_post12275.html

Pad to Pad vs Pad to Thermal Tab - PCB Libraries Forum   Forum Home > General > General Discussion    New Posts    FAQ    Search    Events    Register    Login Pad to Pad vs Pad to Thermal Tab

PCB Libraries, Inc.


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