Industry News | 2018-01-28 19:18:11.0
MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1327 at the 2018 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place February 27th- March 1st, 2018 at the San Diego Convention Center.
Industry News | 2020-06-30 15:07:32.0
MIRTEC is excited to announce its participation in an exclusive ONLINE CONFERENCE & EXPO. The event will be broadcast live on Wednesday, July 8, 2020 from 10 a.m. - 2:30 p.m. EST and will include a full program of live presentations, interviews and special guests.
Industry News | 2020-01-06 16:06:59.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1900 at the 2020 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 4-6, 2020 at the San Diego Convention Center.
Industry News | 2021-10-11 16:13:11.0
MIRTEC will showcase its cutting-edge INTELLI-PRO AI Based Smart Factory Automation Solution and GENSYS-PIN Automotive Pin Inspection System in booth #461, Hall A2 at the 2021 Productronica exhibition. The world's largest exhibition for the electronic manufacturing industry will take place on Nov. 16-19, 2021, at Messe Munich exhibition hall in Germany.
New Equipment | Rework & Repair Equipment
Stainless Steel Brush (SH-60) 2 5/16" Made of over 300 long, fine, stainless steel bristles. Use to clean flux from solder joints, clean flux and adhesive from solder pad and for general cleaning purposes. Available in Standard and Miniature
New Equipment | Rework & Repair Equipment
Made of over 300 long, fine, stainless steel bristles. Use to clean flux from solder joints, clean flux and adhesive from solder pad and for general cleaning purposes. Available in Standard and Miniature sizes. Stainless Steel Brush (3 1/2"
Industry News | 2003-03-21 08:12:24.0
Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.
Used SMT Equipment | SMT Equipment
Model :KE-1070 Pick and Place Machine Placement speed：Chips:18900CPH(0.190sec/chip) Component mount range:0603 chips ~33.5mm Station:80 Power supply:3-phase AC200~415C 3KVA Size:1500*1500*1455mm Weight:1590kg
Used SMT Equipment | SMT Equipment
Model :JX-100 Pick and Place Machine Placement speed：Chips:19300CPH(0.187sec/chip) Component mount range:0603 chips ~33.5mm Power supply:3-phase AC200~415C 1.5KVA Size:1370*1270*1440mm Weight:1000kg
Used SMT Equipment | SMT Equipment
Model:YS12F Pick and Place Machine Placement Speed:20000cph(0.18sec/CHIP Equivalent) Placement Station:47 PCB Size:510*460 Power Supply:3PH,200-415V Dimensions:L1254XW1755XH1450mm Weight:1370kg
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