UV Exposure systems for high definition imaging on presensitised boards. Range from foam pad to vacuum securing of board with analog timers to double sided units with sliding frame and digital control.
The I-2000 Series of UV printing inks were designed for heat sensitive substrates in a wide spectrum of colors. Resistant to solvents, acids and bases, these UV inks will pass Military Specifications 893 and 775. Lite Fast I-2000 adheres to a wide
Electronics Forum | Fri Jan 07 10:27:07 EST 2011 | patrickbruneel
Hi, Detergent/saponifiers have indeed the potential to tarnish aluminum. This is due to the high alkalinity of the chemistry (pH 10-12). Things you can do to minimize the effect is: A) Limit the exposure time of the Al with the chemistry. B) Reduc
Electronics Forum | Thu Aug 23 15:45:48 EDT 2001 | slthomas
So, we've already addressed the tombstoning on these guys by adopting the mfr's (Pana.) recommendations for pad size and spacing. Problem is, we have pretty bad wetting of some of these parts. The rest of the board we use them on looks great, nice
Industry News | 2013-09-26 18:03:10.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test, March 25–27, 2014 at the Mandalay Bay Convention Center, Las Vegas, Nevada.
Industry News | 2013-11-08 17:12:39.0
ACB is Europe's leading manufacturer of quick-turn and high-reliability prototype and small series PCBs. Typically an early adopter of new and enabling technologies, the company recently took delivery of a top-of-the-range LED-based Direct Imaging (DI) system from Ucamco. Manufactured by Dainippon Screen, Ledia 5 is the PCB industry's fastest DI system, and the only one capable of processing standard soldermask: unique capabilities that, together with ACB's trust in its suppliers, were key to the company's latest investment decision. Working alongside ACB's existing Laser DI system, Ledia 5 handles all ACB's soldermask processing and provides added capacity for dry film exposure. With it, ACB is more flexible and has improved its product quality, yields and capabilities while offering shorter leadtimes for its quick-turn business.
Parts & Supplies | Repair/Rework
Repair parts include: CPU circuit board repair and maintenance of the I / O board, servo circuit board repair, the image processing circuit board repair, industrial CCD camera repair, frequency converter repair, PLC repair, touch screen repair, laser
Technical Library | 2020-08-05 18:49:32.0
The evolution of internet-enabled mobile devices has driven innovation in the manufacturing and design of technology capable of high-frequency electronic signal transfer. Among the primary factors affecting the integrity of high-frequency signals is the surface finish applied on PCB copper pads – a need commonly met through the electroless nickel immersion gold process, ENIG. However, there are well-documented limitations of ENIG due to the presence of nickel, the properties of which result in an overall reduced performance in high-frequency data transfer rate for ENIG-applied electronics, compared to bare copper. An innovation over traditional ENIG is a nickel-less approach involving a special nano-engineered barrier designed to coat copper contacts, finished with an outermost gold layer. In this paper, assemblies involving this nickel-less novel surface finish have been subjected to extended thermal exposure, then intermetallics analyses, contact/sheet resistance comparison after every reflow cycle (up to 6 reflow cycles) to assess the prevention of copper atoms diffusion into gold layer, solder ball pull and shear tests to evaluate the aging and long-term reliability of solder joints, and insertion loss testing to gauge whether this surface finish can be used for high-frequency, high density interconnect (HDI) applications.
Career Center | Bangalore-560026, Karnataka India | Engineering,Maintenance,Technical Support
New Product Introduction & Product dovelopment
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/support/plasma-learning-center/secondary-plasma
. Secondary plasma is typically used when a less intense plasma exposure is desired or the sample is sensitive to specific components of a primary plasma
Blackfox Training Institute, LLC | https://www.blackfox.com/blog/guide-to-a-successful-lead-free-soldering/
. By eliminating lead in soldering, we are also eliminating lead in many products that have been manufactured recently. Fewer electronics made with lead means less exposure to the lead by consumers and workers alike
