Full Site - : pad moisture absorption (Page 7 of 27)

NPL to Host SMART Group Conformal Coating Event

Industry News | 2013-09-03 08:16:49.0

SMART Group announces that it will host “Improving Reliability with Conformal Coating” on Thursday, 24th October at the NPL facility in Teddington, London.

The SMART Group

AI Technology, Inc (AIT) Develops Conformal Coatings to Protect Electronics in Extreme Environments

Industry News | 2014-10-14 11:36:35.0

AI Technology, Inc (AIT) Develops Conformal Coatings to Protect Electronics in Extreme Environments. AI Technology (AIT) is proud to present its improved Prima Protect™ coating line for moisture and salt fog protection.

AI Technology, Inc. (AIT)

AI Technology, Inc. (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF)

Industry News | 2014-05-07 16:11:10.0

AI Technology (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF), Combines High Glass Transition Temperature and Stress Absorption with Proven Thermal Performance in Die-Attach Power Dissipation.

AI Technology, Inc. (AIT)

AI Technology, Inc. (AIT) Releases Cool-Gumpad™ (Thermal Interface Pad) CGP7156

Industry News | 2014-06-05 12:21:18.0

AI Technology introduces COOL-GUMPAD™ CGP7156, a new class of thermal interface material with extreme compressibility to fill in all uneven and unparallel thermal interface surfaces in LED luminaire modules, large area power modules and large area metal-core printed wiring board (MCPWB) applications.

AI Technology, Inc. (AIT)

New Yorker Electronics Releases New Adam Tech Waterproof Discrete Pogo Pins

Industry News | 2020-12-10 14:18:13.0

IP Rated Spring-Loaded DIP Pins from Adam Tech Interconnects Prevent Moisture from Entering the Pin around Barrel Seams

New Yorker Electronics

MacDermid Alpha to Promote Latest Interconnect Technologies and Present on Microvia Reliability at the 2021 Virtual IPC APEX Exhibition and Conference

Industry News | 2021-02-25 13:41:10.0

MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021.

MacDermid Alpha Electronics Solutions

What's usage of Via tenting for PCB design?

Industry News | 2019-11-05 22:07:01.0

Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.

Headpcb

Desktop Reflow Oven R3028

Desktop Reflow Oven R3028

New Equipment | Reflow

Introduction This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the tempe

HuiKe Tech

Desktop Reflow Oven R1825

Desktop Reflow Oven R1825

New Equipment | Reflow

This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the temperature control

HuiKe Tech

Lead Free Desktop Infrared  Reflow Oven 1816

Lead Free Desktop Infrared Reflow Oven 1816

New Equipment | Reflow

The R1816 infrared reflow oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the

HuiKe Tech


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