Electronics Forum | Wed Nov 09 02:24:49 EST 2005 | laxman
Hi Dave, Normally in our country (India) during rainy season the temperature will be 25to 30 �C and RH of 50 to 60%. The reason behind this humidity issue is that recently we have moved to our new facility with centralised air conditioner with Chill
Electronics Forum | Mon Nov 07 06:16:59 EST 2005 | laxman
Hi, We have faced the solderability issue (Dewetting and solder balls)in all the Boards after reflow.When we found this issue we discarded the old paste and started using the new paste then for some hours the solderability found to be O.K. After so
Electronics Forum | Mon Dec 31 09:00:06 EST 2001 | davef
Baking before assembly does nothing good. It: * Increases costs. * Adds steps to the process and makes scheduling more cumbersome. * Increases the amount corrosion on solderable surfaces. We used to bake to remove the moisture from boards that caus
Electronics Forum | Fri Jan 21 13:27:38 EST 2011 | mosborne1
Try baking your boards first to remove the moisture. Moisture and boards that have not been drilled properly will cause pin hole or blow holes in PTH. Also take a look the surface of the pads before printing. You maybe contaminating the surfaces of t
Electronics Forum | Thu Jan 13 17:46:04 EST 2011 | davef
We've never seen the defect that you describe, but in wave soldering-land blowholes usually are caused by moisture in the board that out-gasses through the too thin plating of through holes. * Bandaid fix: bake the boards * Long-term fix: Obtain boar
Electronics Forum | Fri Mar 02 08:52:20 EST 2001 | markkrmp
Are your voids looking like blow holes also? Is this only occurring on the solder joints of the Thru Hole components and Via's? Or does this happen on SMD pads? My experience is that we have seen this but only with some of our older PCB's which are
Electronics Forum | Wed Nov 07 17:11:14 EST 2001 | davef
1 CAN WAVE SOLDER AFFECT OR DAMAGE BGA? Sure. Since you are vague, assuming: * Partially assembled board was not stored to prevent moisture absorption. * BGA is in a plastic package. * Partially assembled board was stored long enough to exceed th
Electronics Forum | Sat Jun 06 15:11:17 EDT 2009 | ysutariya
Was this a lead-free capable material that fits into IPC 4101/126 or /129, like an Isola 370HR? I would not be surprised because from the picture I think I can see resin underneath the lifted copper, which is an interlaminate separate. This is a
Electronics Forum | Sat Jun 06 15:14:35 EDT 2009 | ysutariya
If the concern is the increased moisture absorption associated with lead-free capable materials, you probably have the most experience with phenolic materials like Isola IS410 or 370HR. The best move would be to switch to an IPC 4101/99 or /124 mate
Electronics Forum | Wed Jun 18 07:26:42 EDT 2003 | rmurtuza
Do BGA packages absorb moisture to a great extent if kept exposed to an atmosphere of 300C and 60% relative humidity overnight? Should they be backed before reuse. How long can they be kept exposed without the requirement of baking. Are there any spe
