Industry Directory | Manufacturer
A manufacturer of desoldering braid (wick) with an emphasis on continuing advancement in soldering/desoldering technology, visual and x-ray inspection systems, fume extraction, and solder paste inspection systems.
Industry Directory | Manufacturer
Boasting a complete EMS (electronic manufacturing services) production, engineering, and distribution facility we differentiate our services through: ��Aggressive pricing ��Rapid, responsive turnaround ��Personalized customer service�
New Equipment | Education/Training
In this One-Day class you will learn successful techniques to re-ball BGA Components. Both Lead and Lead Free Solder Balls will be covered. The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the
Standard Silicone-Base Thermal Pads Qoolite – Cool Provide (SPVS) Flame resistant, high performance thermally conductive sheet Silicon Free Thermal Conductive Sheet Featuring Electromagnetic Wave Absorption Properties. High thermal conductiv
Electronics Forum | Tue Nov 08 20:58:49 EST 2005 | davef
We buy humidity as a potential cause of solder balls, but we're not biting on dewetting. Something else is causing that. Questions are: * What's the temperature and RH of your SMT production area? * What kind of paste are you using? [Some water was
Electronics Forum | Wed Nov 09 10:25:09 EST 2005 | Amol
where in india are you laxman? and what kind of manufacturing are you involved in?
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Technical Library | 2020-11-29 22:06:45.0
Plastic laminates are increasingly used as interposers within chip packaging applications. As a component within the package, the laminate is subjected to package moisture sensitivity testing. The moisture requirements of chip packaging laminates are related to ambient moisture absorption and thermal cycling. Printed wiring board (PWB) laminates, however, are gauged on properties relating to wet processes such as resist developing, copper etching, and pumice scrubbing. Consequently, printed wiring board moisture absorption test methods differ from chip packaging test conditions.
Technical Library | 2020-12-16 18:38:49.0
Fabrication of large structures using out-of-autoclave prepreg materials will lead to a great amount of savings in manufacturing costs. In the out-of-autoclave processing method, the presence of voids inside the laminate has been an issue due to the lack of high pressure during manufacturing. This study aims primarily to observe the moisture absorption response of composite samples containing different levels of void. By changing the vacuum level inside the bag during the manufacturing process, three different unidirectional laminates at three levels of void have been manufactured. After immersing the samples in warm water at 60°C for about one year, the moisture absorption level was monitored and then diffusion coefficients were calculated using Fick's law. Results show that the moisture absorption coefficient changes by %8 within the experimental range of void contents. The mechanical behaviour of these laminates has been studied at four different moisture levels by performing dynamic mechanical analysis (DMA) and short beam shear tests. Empirical results indicate that, in general, interlaminar shear strength and glass transition temperature decrease by moisture build-up inside the samples. DiBenedetto equation is proposed to make a correlation between the moisture content and glass transition temperature.
This video is designed to help packaging engineers, quality control managers and those tasked with preserving critical parts in enclosed spaces for storage and usage. The video will highlight different features and benefits of the Moisture Hog desic
Great improvements on Makerfabs Lora Soil Moisture Sensor V3!!! 1. TLC555 removed, while the Atmega328P(D9/Timer1) generates the 2 MHz pulse (only during measurement phase, switching off afterward), for capacitive moisture measurement. 2. Unique ID b
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/page/155?order=name+desc
0.0 CNY VACUUM ABSORPTION ¥ 0.00 0.0 CNY VACCUM VALVE L ASM ¥ 0.00 0.0 CNY VACCUM SENSOR BRD ASSY ¥ 0.00 0.0 CNY VACCUM PUMP KIT 4M BASE DOP-420SA/420S ¥ 0.00 0.0 CNY VACCUM PAD ¥ 0.00 0.0 CNY VACCUM PAD ¥ 0.00 0.0 CNY VACCUM PAD ¥ 0.00 0.0 CNY VACCUM PAD ¥ 0.00
| https://www.eptac.com/faqs/ask-helena-leo/ask/ceramic-ccas-and-aqueous-wash-and-bake-out-prior-to-parylene-coating
: I have a question concerning ceramic CCA and their bake out after aqueous wash cycle prior to parylene coating. In theory, parylene deposition will draw off any moisture before the coating process
