New Equipment | Surface Finish
Designed for wafer processing, Nordson MARCH's SPHERE™ series plasma systems, the StratoSPHERE offers superior plasma treatment for high-throughput advanced semiconductor packaging applications. The StratoSPHERE plasma system is ideal for wafer pro
Industry News | 2018-10-09 18:31:30.0
Whether in production, or repair and rework, the cost of soldering iron tips can be easily overlooked, but with today’s requirement for higher temperatures in lead-free solder applications, the consumption of tips has dramatically increased. This fact, combined with changes in tip design to meet the higher thermal load requirements, has also resulted in escalating tip costs, making tip care a high priority.
Technical Library | 2020-10-14 14:33:36.0
Epoxy based adhesives are prevalent interface materials for all levels of electronic packaging. One reason for their widespread success is their ability to accept fillers. Fillers allow the adhesive formulator to tailor the electrical and thermal properties of a given epoxy. Silver flake allow the adhesive to be both electrically conductive and thermally conductive. For potting applications, heat sinking, and general encapsulation where high electrical isolation is required, aluminum oxide has been the filler of choice. Today, advanced Boron Nitride filled epoxies challenge alternative thermal interface materials like silicones, greases, tapes, or pads. The paper discusses key attributes for designing and formulating advanced thermally conductive epoxies. Comparisons to other common fillers used in packaging are made. The filler size, shape and distribution, as well as concentration in the resin, will determine the adhesive viscosity and rheology. Correlation's between Thermal Resistance calculations and adhesive viscosity are made. Examples are shown that determination of thermal conductivity values in "bulk" form, do not translate into actual package thermal resistance. Four commercially available thermally conductive adhesives were obtained for the study. Adhesives were screened by shear strength measurements, Thermal Cycling ( -55 °C to 125 °C ) Resistance, and damp heat ( 85 °C / 85 %RH ) resistance. The results indicate that low modulus Boron Nitride filled epoxies are superior in formulation and design. Careful selection of stress relief agents, filler morphology, and concentration levels are critical choices the skilled formulator must make. The advantages and limitations of each are discussed and demonstrated.
Dinghua Technology-- the leading manufacturer of BGA rework station, Automatic screw locking machine, Automatic soldering station and non-standard equipment. For more details, please just contact John, WhatsApp/Wechat:+86 1576811 4827 , Skype: si
Industry News | 2019-05-16 01:27:23.0
There are several surface treatment for PCB board: bare board (no treatment on the surface), rosin board, OSP (Organic Solderability Preservatives), HASL (lead tin, lead-free tin), plating gold, immersion gold, etc., these are relatively conscious treatment. Many people can't tell the difference between plating gold and immersion gold, thinking that it is the same thing, it is a big mistake. The following is a brief introduction to the difference between plating gold and immersion gold.
The SX-100 Sodr-X-Tractor is the solder extraction handpiece for high volume operations. It uses PACE's new SX-100 desoldering tips, the longest lasting desoldering tips availible on the market today. The SX-100 features a disposable collection chamb
Industry News | 2012-07-19 13:34:37.0
The Balver Zinn Group announces that Cobar Solder Products Inc. now carries the Balver Zinn Braid, a desoldering braid with a no-clean flux formulation
New Equipment | Solder Materials
SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages
Industry News | 2008-03-13 20:19:57.0
Pomona, CA - March 2008 -The Contacts Product Group (CPG) of Everett Charles Technologies (ECT) and atg Test Systems announces that it will exhibit LFRE, its Lead-Free POGO Contacts, in booth 1383 at the upcoming APEX 2008 conference and exhibition, scheduled to take place April 1-3, 2008, in Las Vegas.
Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)
Industry News | 2010-06-23 12:37:04.0
NASHVILLE — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Debbie Carboni, Mid-Atlantic Territory Manager, will present a paper titled “Cause, Effects and Solutions for White Residue Formation” at the upcoming SMTA West Pennsylvania Chapter meeting. The presentation is scheduled to take place on Friday, July 23, 2010 at Aerotech’s headquarters in Pittsburgh, PA.
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