Industry News | 2018-03-11 11:38:15.0
Flextron Circuit Assembly has added 3D Solder Paste Inspection (SPI) capability and Automated Optical Inspection (AOI) to its PCBA manufacturing lines, ensuring high quality and reliability in its finished electronic assemblies.
Industry News | 2024-03-18 12:35:19.0
SHENMAO Technology will exhibit its cutting-edge solutions for automotive electronics at Booth 2639 during the upcoming IPC APEX EXPO 2024. Taking place April 9-11, 2024 at the Anaheim Convention Center in California, the expo will provide an opportunity for industry professionals to explore SHENMAO's latest advancements in solder paste technology.
Industry News | 2010-08-10 14:16:50.0
The Electronics Assembly and Packaging Technology Expo 2010 (ATE China 2010) will take place between August 31 and September 2 at the Shenzhen Convention & Exhibition Center. The expo will highlight various types of electronics assembly and packaging facilities, both locally and abroad. It also will offer technical solutions to assembly and production problems and allow buyers to identify new suppliers ― all of which will enhance competitiveness in the industry.
Industry News | 2015-11-16 10:47:48.0
Catching up with PNC with Dan Beaulieu, D.B. Management Group
Electronics Forum | Tue Apr 13 11:41:18 EDT 2021 | jeremy_leaf
I have a SAC305 preform with which I am attempting to bond a gold coated component to an ENIG coated PCB pad. I've specified 2 microinches of gold for the ENIG. It worked previously but now with a new batch of boards, I am having an issue where the p
Electronics Forum | Wed Apr 09 09:48:49 EDT 2003 | iman
after oven bake dry the PCB, we process within 4-hrs, else need to rebake again under same baking parameter. taking a look, the exact pads with the blowholes are full ENIG pads with no via holes under the solder-intend land areas. In event there is
Electronics Forum | Mon Apr 07 04:33:43 EDT 2003 | Neil
Iman, How long after washing the boards do you process them? Are there any vias or Micro vias on any of the pads you see the blow holes on? A possible cause of a blow hole in a solder fillet or PCB is the escaping of Moisture under extreme temps. Th
Electronics Forum | Fri Apr 09 20:47:36 EDT 2010 | 89jeong
I think the oxidation on the pad happens easily but do not on Au plated pad.The reason may be caused by improper cleaning or Au plating thickness in plating process. But,before suspecting the pcb board, you need to check your process or used material
Electronics Forum | Fri Apr 09 09:08:40 EDT 2010 | cast2010
Hello, I produce two types of board. - 100% Thru Hole - 50% thru hole and 50% SMT For the second, I have a bad wetting after the reflow on the top. The pcb board have Au-Ni pad. I use a water soluble paste. I clean the board with a solution with
Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
Main Products: 1. Original new and Original Used SMT/AI Spare Parts. 2. SMT Equipments And Related Machine( SMT Calibration, SMT Feeder Carts,Conveyer etc.) 3. Maintenace and Repair Service Pre-Sales Service Provide details ab
Manufacturer's Representative / Manufacturer / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
Building A, Jiepeng Square, Fuyong
Shenzhen, 30 China
Phone: 0755-33578694
