We are proud to introduce Takaya's latest contribution to the world of fixtureless test...the APT-9401SL. With the ability to accept a board as large as 25"W x 26"L, the APT-9401SL is designed to meet the needs of the most demanding flying probe test
This unit is used for removing dust, particles, glass fiber & etc on bare PCBs surface. • SMEMA Interface • For bare board • PCBs placed at front • 3-color LED light tower • Buzzer • Safety full cover • P
Industry News | 2018-10-18 08:14:11.0
How to Prevent the Tombstone and Open Defects during the SMT Reflow Process
Industry News | 2003-06-20 18:28:55.0
Makes continuity and placement evaluation a snap.
Technical Library | 2019-08-07 22:56:45.0
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are designed to enhance the thermal and electrical performance of the component and ultimately allow the component to run more efficiently. Additionally, low voiding is important in decreasing the current path of the circuit to maximize high speed and RF performances. The demand to develop smaller, more reliable, packages has seen voiding requirements decrease below 15 percent and in some instances, below 10 percent.Earlier work has demonstrated the use of micro-fluxed solder preforms as a mechanism to reduce voiding. The current work builds upon these results to focus on developing an engineered approach to void reduction in leadless components (QFN) through increasing understanding of how processing parameters and a use of custom designed micro-fluxed preforms interact. Leveraging the use of a micro-fluxed solder preform in conjunction with low voiding solder paste, stencil design, and application knowhow are critical factors in determining voiding in QFN packages. The study presented seeks to understand the vectors that can contribute to voiding such as PCB pad finish, reflow profile, reflow atmosphere, via configuration, and ultimately solder design.A collaboration between three companies consisting of solder materials supplier, a power semiconductor supplier, and an electronic assembly manufacturer worked together for an in-depth study into the effectiveness of solder preforms at reducing voiding under some of the most prevalent bottom terminated components packages. The effects of factors such as thermal pad size, finish on PCB, preform types, stencil design, reflow profile and atmosphere, have been evaluated using lead-free SAC305 low voiding solder paste and micro-fluxed preforms. Design and manufacturing rules developed from this work will be discussed.
Industry News | 2012-04-09 13:45:59.0
As the electronics assembly industry evolves, printed circuit board (PCB) features and surface mount technology (SMT) components continue to get smaller and smaller. This miniaturization shrinks the process window at print, placement, and reflow, increasing the opportunities for defects.
New Equipment | Solder Paste Stencils
PNC Inc. uses LPKF Laser Technology to manufacture SMT Solder paste stencil, high tolerance aperture openings with superior registration for it’s solder paste stencils. With it’s 4 mil beam diameter, our Laser is capable of cutting small aperture ope
Industry Directory | Manufacturer / Other
OEM Contract Manufacturer, Prototype production, battery testing, quick turn production, high/Low volume production. OEM products, complete box build, sub assembly, battery chargers, power supplies, microphones, cable and flex assembly.
Industry News | 2018-10-18 11:19:07.0
How To Design Cost-Effective PCBs
