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Fine Pitch Wave Soldering

Electronics Forum | Sat Mar 12 18:32:29 EST 2011 | jlawson

It is pretty hard to wave solder fine pitch parts bad enought with 0.5mm let alone 0.4mm It can be done but need N2 inert wave soldering & need layout design to accommodate this... Iy it is a QFP need to run part 45 deg into wave and if possible in

Through-hole Connector Wave Solder Questions

Electronics Forum | Wed Feb 20 13:23:33 EST 2002 | dgeorge

I have some interesting problems on my hands that some of you may know the answers to. I am currently wave soldering a through hole connector to a rigidized flexible circuit. This is a compliant pin connector that is supposed to be pressed into a h

Re: footprint formula

Electronics Forum | Wed Mar 08 21:16:38 EST 2000 | Dave F

Wolfgang: I agree that the IPC pads are reflow / top side wave solder. We run bottom-side PCLL at 45� to the wave with fairly involved solder thieves. Ta. Dave F

Re: footprint formula

Electronics Forum | Wed Mar 08 21:16:38 EST 2000 | Dave F

Wolfgang: I agree that the IPC pads are reflow / top side wave solder. We run bottom-side PCLL at 45� to the wave with fairly involved solder thieves. Ta. Dave F

Fillet height of SMT chip capacitor

Electronics Forum | Wed Jan 30 13:17:22 EST 2019 | slthomas

In addition to robl's suggestions, I would look at the footprint on the board to make sure it meets the recommended dimensions. Abnormal layouts, particularly when pads extend under the component too far, can be problematic both by lifting the part

Re: Closer lead more soldering bridge by using spray flux

Electronics Forum | Tue Jun 08 12:49:41 EDT 1999 | Dave F

| Hi,my master | How to iron out such soldering bridge with below conditions: | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | 3.using spraying fluxer and n

Re: Closer lead more soldering bridge by using spray flux

Electronics Forum | Tue Jun 08 13:06:53 EDT 1999 | Kevin Hussey

| | Hi,my master | | How to iron out such soldering bridge with below conditions: | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | 3.using spraying fl

Oooooh noooooo!!!

Electronics Forum | Tue Jun 08 14:16:49 EDT 1999 | Dave F

| | Hi,my master | | How to iron out such soldering bridge with below conditions: | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | 3.using spraying fl

two-sided design guidelines

Electronics Forum | Fri Oct 18 09:50:02 EDT 2002 | russ

Steve, I am not aware of any standards so to speak. But IPC 782 and 770 have some useful info regarding mounting and pad geometries for wave etc... Since I do not know what type of components you will be wave soldering I will just give you some

Re: Waving TSOPs

Electronics Forum | Fri May 08 18:39:17 EDT 1998 | Steve Gregory

| | As usual, we are faced with too many components and not enough board on a new design. Does anyone have experience wavesoldering .025" pitch TSOPs on the bottom side? | | Any advice is appreciated. | | Greg Hi there Greg! First, I just gotta


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