Industry News | 2009-04-08 15:42:01.0
WATERTOWN, MA - April 2009 � Devoted to the development of new radiation detector and systems technology, RMD Instruments LLC announces that it will premier a new solder analysis and identification feature of its innovative LeadTracer-RoHS XRF system in booth 1042 at the upcoming NEPCON East Exhibition and Conference, scheduled to take place April 22-23, 2009 at the Boston Convention & Exhibition Center in Boston, MA.
Technical Library | 2017-09-28 16:36:33.0
These nano-coatings also refine the solder paste brick shape giving improved print definition. These two benefits combine to help the solder paste printing process produce an adequate amount of solder paste in the correct position on the circuit board pads. Today, stencil aperture area ratios from 0.66 down to 0.40 are commonly used and make paste printing a challenge. This paper presents data on small area ratio printing for component designs including 01005 Imperial (0402 metric) and smaller 03015 metric and 0201 metric chip components and 0.3 mm and 0.4 mm pitch micro BGAs.
Industry News | 2014-07-15 14:38:39.0
Kyzen announces that it will exhibit AQUANOX® A4639 Electronic Assembly Aqueous Solution at the SMTA Philadelphia Expo & Tech Forum, scheduled to take place Tuesday, August 12, 2014 at the Crowne Plaza Philadelphia in New Jersey.
Industry News | 2014-04-30 18:31:11.0
SMT electronics assemblers can nearly double their stencil printing throughput without doubling their machine footprint with the new MPM Momentum BTB (Back to Back) printer.
Industry News | 2013-09-09 16:09:16.0
Kyzen announces that Debbie Carboni will present at the upcoming Cleaning and Reliability workshop, together with Aqueous Technologies, FCT Assembly,
Industry News | 2012-03-24 10:06:28.0
NEPCON China Becomes a Platform for the Debut of New Product Releases in Asia
Industry News | 2018-10-18 09:46:58.0
Analysis of how to spot welding process
Technical Library | 2024-07-24 01:04:35.0
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size, such as a near die size footprint, thin profile, and light weight; (2) easy PCB trace routing due to the use of perimeter I/O pads; (3) reduced lead inductance; and (4) good thermal and electrical performance due to the adoption of exposed copper die-pad technology. These features make the QFN an ideal choice for many new applications where size, weight, electrical, and thermal properties are important. However, adoption of QFN often runs into voiding issue at SMT assembly. Upon reflow, outgassing of solder paste flux at the large thermal pad has difficulty escaping and inevitably results in voiding. It is well known that the presence of voids will affect the mechanical properties of joints and deteriorate the strength, ductility, creep, and fatigue life. In addition, voids could also produce spot overheating, lessening the reliability of the joints.
Industry News | 2018-10-18 08:34:52.0
How to Prevent Solder Bridging in 3528 PLCC6 RGB LEDs?
Technical Library | 2015-06-11 21:20:29.0
The use of bottom terminated components (BTC) has become widespread, specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type, improved electrical and thermal performance relative to older packaging technology, and low cost make the QFN/BTC attractive for many applications.Over the past 15 years, the implementation of the QFN/BTC package has garnered a great amount of attention due to the assembly and inspection process challenges associated with the package. The difference in solder application parameters between the center pad and the perimeter pads complicates stencil design, and must be given special attention to balance the dissimilar requirements
