Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Industry News | 2018-10-18 08:17:09.0
How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process
Industry News | 2013-10-28 16:31:54.0
IPC Conference on Solder and Reliability: Materials, Processes and Tests, November 13–14 in Costa Mesa, Calif.
Industry News | 2013-02-27 15:04:56.0
February 2013 ― OK International will demonstrate the new Metcal MX-5200 Soldering, Desoldering and Rework Series in Booth E22 at the Enova Grand Ouest exhibition, scheduled to take place March 27-28, 2013 in Rennes, France.
Industry News | 2009-04-23 20:54:01.0
MINNEAPOLIS, MN � The SMTA is pleased to announce its latest technical event in Penang, Malaysia. The SMTA South East Asia Technical Conference on Electronics Assembly Technologies will be held November 19-20, 2009 at the Equatorial Hotel in Penang, Malaysia. Presentations are currently being solicited for the following key technology tracks:
Industry News | 2018-10-18 10:04:27.0
How to Decrease PCB Fabrication and Assembly Costs While Maintaining High Quality
Industry News | 2015-08-23 09:03:52.0
IPC — Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit technical conference abstracts for IPC APEX EXPO 2016 at the Las Vegas Convention Center in Las Vegas. The technical conference will be held March 15-17, 2016. The deadline for technical conference paper abstracts has been extended to September 14,, 2015.
Industry News | 2011-09-14 12:04:43.0
The SMTA announced a session on QFN Assembly and Reliability will take place on Tuesday, October 18 during their annual conference, SMTA International, in Ft. Worth, Texas. Andrew Mawer of Freescale Semiconductor will chair the session and Viswam Puligandla, Ph.D., Nokia (Retired) will co-chair.
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Industry News | 2012-02-23 14:43:13.0
IPC has announced the winners of the Best U.S. and International Papers of IPC APEX EXPO® 2012. Selected through a ballot process by the event’s Technical Program Committee, the papers will be presented at IPC APEX EXPO, February 28–March 1, at the San Diego Convention Center.
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