Technical Library | 1999-05-07 08:45:39.0
Fine pitch SMT devices, although certainly not new, present more of an assembly processing challenge than 50 mil pitch devices. In fact it seems that the finer the pitch the more difficult or narrower the process window becomes. Besides the pitch of the leads being less on fine pitch devices narrower pad width on the board is typical. With fine pitch designs the board fabrication process is also stressed in that the strip of mask between the pads is designed narrower, the alignment of the mask to copper becomes more critical
Industry News | 2017-10-15 18:00:10.0
Pickering Interfaces will showcase their latest high-density PXI and Ethernet LXI Switching & Simulation Solutions at Auto Testing Expo 2017 in booth 11046, in Detroit, MI, including:
Industry Directory | Consultant / Service Provider
CAD Design Software products run in the AutoCAD environment.
Industry News | 2017-10-17 19:05:59.0
Pickering Interfaces will highlight their latest high-density PXI and Ethernet LXI Switching & Simulation Solutions at the International Test Conference (ITC) 2017 in booth 501, in Ft. Worth, including:
Industry News | 2017-10-30 20:39:58.0
Pickering Interfaces will highlight their latest high-density PXI and Ethernet LXI Switching & Simulation Solutions at the International Test Conference (ITC) 2017 in booth 501, in Ft. Worth, including:
Technical Library | 2023-05-02 18:50:24.0
Surface-mount PCB components are smaller than their lead-based counterparts and provide a radically higher component density. They are available in a variety of shapes and sizes designated by a series of standardized codes curated by the electronics industry. Of these PCB components, the 0201-sized are the smallest, measuring 0.024 x 0.012 in. (0.6 x 0.3 mm) – that's 70% smaller than the previous 0402 level! The 0201 components are designed to improve reliability in space-constrained applications such as portable electronics like smartphones, tablets, robotics and digital cameras, but require delicate handling during the assembly process. Given the miniaturized dimensions of an 0201 package, it is crucial that the mounting process abide by a series of guidelines regarding the design of the PCB mounting pads and solderable metallization, PCB circuit trace width, solder paste selection, package placement and overages, solder paste reflow, solder stencil screening, and final inspection. It's advisable that one review this information when procuring the services of a PCB assembler.
Industry Directory | Manufacturer
D-Ying PCB manufacturers have the technological capabilities to produce your most advanced and demanding PCB products quickly
Industry News | 2018-10-18 10:24:05.0
The Design Principles of Stencil Apertures
The MEGARIDER™ family helps you to know more about the behavior of your oven. Use them to characterize for development, verify for production, or qualify pre-purchase. Equal masses across the width of the boards, permit PCB-like profiles that give in
New Equipment | Rework & Repair Equipment
Visit PSI's main Coplanarity Services page for more information. PSI has over 20 years experience restoring gull wing leads on QFP and SOIC packages, as well as myriad surface mount connector styles. The goal of lead restoration is not to mimic "l
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