New Equipment | Industrial Automation
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New Equipment | Industrial Automation
Sales Manager: Sandy Lin Email: unity@mvme.cn Skype: onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC, M
Electronics Forum | Wed May 07 01:50:03 EDT 2008 | andrzej
We have received in one lot PCBs with defect of not wetting properly. Pads were finished with HASL but they were matte rather then shiny (attachment). For me looks like they are oxidized. Interesting is there was just top side with such defect. We h
Electronics Forum | Thu Jun 29 04:50:42 EDT 2023 | SMTA-70263692
This looks like it could be related to oxidation.Do you per-bake your pcb before assembly to remove any moisture inside your board panel?
Electronics Forum | Thu Jun 29 10:53:30 EDT 2023 | matouschekd
Repairing these PCBs was not an option due to the delivery amount. Oxidation is unlikely, as these anomalies were visible right after unpacking them and the humidity card was not suspicious. We have since decided not to use these PCBs as the risks w
Electronics Forum | Mon Sep 08 09:59:56 EDT 2008 | vladig
Here we go with another "solderability problem". How do you know the pads on the bare PCB are oxidized? Just based on its colour? If that is the root cause, then why ohter parts on the same board are fine? If you want to solve the problem, get it's
Electronics Forum | Wed Sep 10 10:49:23 EDT 2008 | slthomas
You missed my point. People often don't find the need to post their problems here to begin with because "knob turning" solved them *before* they needed to lean on the collective experience of SMTnet, Technet, or what-have-you. Your posts seem to b
Electronics Forum | Fri Dec 12 11:52:59 EST 2003 | Marc Simmel
I have encountered problems with a 90/10 tin-lead plated SMT component wicking all the solder paste off the pads on the substrate. Worst, the defect occurs randomly - adjacent leads may have 'good' joints, though heel fillets are poor. The solder pa
Electronics Forum | Mon Dec 22 19:43:43 EST 2003 | Dean
I have seen this affect on Immersion Tin and OSP. 70 to 90 % of the solder wicks to the lead and forms a "single" homogenous solder mass. This even though the pad was 100 % covered with paste... Evaluated different solder paste...did find variatio
Electronics Forum | Wed Jul 08 16:28:25 EDT 2020 | duchoang
OSP board finish is the issue. With OSP microBGA board, we need to have enough paste (enough flux) on pads (small pads on BGA), also we need to have strong, more activate flux to get rid of Preservative layer on top of pads. In this case, the OSP did