Full Site - : palomar die bonder (Page 7 of 15)

ESEC Receives Intel Quality Award

Industry News | 2002-03-19 08:04:17.0

ESEC received a 2001 Preferred Quality Supplier (PQS) award from Intel Corp. for outstanding performance in providing products and services deemed essential to Intel's success. The company was awarded for its efforts in supplying Intel with flip chip attach equipment and die bonders.

ESEC

Panasonic’s New Process-flexible Flip Chip Bonder Garners Interest of NA High-Reliability Manufacturers at Semicon

Industry News | 2014-07-29 12:36:04.0

Panasonic Factory Solutions Company of America’s new process-flexible, flip chip bonder garnered the interest of North American high-reliability manufacturers—from photonics to high frequency devices—at Semicon West 2014.

Panasonic Factory Solutions Company of America (PFSA)

Undetected Pressure Variations in Flip Chip Assembly Reduce Yields and Raise Costs

Industry News | 2009-12-22 10:09:22.0

Pressurex® Sensor Film Needed to Measure Contact Pressure Variations Across Flip Chip Dies and Bonding Tools

Sensor Products Inc.

Essemtec Introduces FLX2010C System with Vacuum Downholder for Flex Board Component Placement

Industry News | 2008-09-08 03:46:39.0

Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that it has worked with leading suppliers of die bonders to develop a highly economical solution for the efficient placement of special components on film or flex boards, providing many benefits to the users.

ESSEMTEC AG

Machine Vision Products Demonstrates Diverse Inspection Toolbox for Microelectronics and Packaging on the MVP 850G AOI at Productronica 2013

Industry News | 2013-11-06 14:17:59.0

Machine Vision Products will be demonstrating its 850G inspection solutions on Booth 220 in Hall A2 at the Productronica 2013 exhibition.

Machine Vision Products, Inc

Saline Lectronics Announces New In-house Wire Bonding Capability

Industry News | 2015-08-11 09:37:25.0

Saline Lectronics now offers wire bonding in-house as an added-value service. With the installation of the Kulicke & Soffa 4500 Manual Wedge Bonder, Saline Lectronics is now one of the only electronic contract manufacturers in the Midwest to support wire bonding services. 

Saline Lectronics, Inc

High Accuracy Die Bonder on display at Semicon West 2009

Industry News | 2009-06-23 19:41:14.0

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 712 at the upcoming Semicon West, scheduled to take place July 14-16, 2009 at the Moscone Center in San Francisco, Ca.

Finetech

FINETECH to Showcase Modular Die Bonder at IMAPS 2011 – Long Beach

Industry News | 2011-09-12 13:16:36.0

FINETECH will showcase the FINEPLACER® Lambda in Booth #306 at the upcoming IMAPS 44th International Symposium on Microelectronics exhibition

Finetech

High-Accuracy R&D Die Bonder on Display at Finetech Booth #505 at IMAPS 2012 – San Diego

Industry News | 2012-09-05 08:13:47.0

Finetech will showcase the FINEPLACER® Lambda in Booth #505 at the upcoming IMAPS 45th International Symposium on Microelectronics exhibition

Finetech

Senior Engineering Microassembler

Career Center | Brooklyn, New York USA | Engineering,Production

Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications.  With design, sales and manufacturing locations in over 30 countries, Mini-Ci

Mini-Circuits


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