New Equipment | Education/Training
This is a combination lectured and hands-on course covering the information in the IPC J-STD-001 document. The J-STD-001, “Requirements for Soldered Electrical & Electronic Assemblies”, describes materials, method and acceptance
New Equipment | Education/Training
This program is for experienced solderers seeking an in depth knowledge of the J-STD-001 Document. The course reviews this document and helps students learn how to interpret the criteria. Open and closed book exams are required after each module. Han
Electronics Forum | Tue May 12 10:03:12 EDT 2009 | daan_terstegge
Hi All, I see more and more components like QFN or LGA with bottom-only terminations,with landpatterns getting finer all the time. I have no ppm-figures of our process, but based on a benchmark study by Agilent I'd say that 500 ppm is a decent value
Electronics Forum | Wed May 20 17:56:51 EDT 2009 | dyoungquist
I have attached a pdf showing the dimensions for the QFN we placed. First, The pins on the part are not only on the bottom side but also wrap around to come up each of the 4 sides of the part as shown in the side view in the attached pdf. This i
Industry News | 2003-06-18 07:47:47.0
The training certification program, which assures its participants immediate industry recognition, legitimacy and value, is designed to train operators and potential instructors on proper cable and wire harness fabrication and installation.
Industry News | 2012-11-02 09:04:14.0
IPC and SMTA jointly announce the agenda for Session 5 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.
Parts & Supplies | SMT Equipment
contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 best quality & lower price more than we can offer 40000631 CABLE SAFETY B 40000746 CABLE CLAMP X 40001255 SENSOR CABLE GUIDE 50 40001261 SENSOR CABLE GUIDE 60 40001306 CABLE
Technical Library | 2014-10-23 18:10:10.0
The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller components, no-clean lead-free solder technologies, competitive forces and automated assembly create process challenges. Cleanliness under the bottom terminations must be maintained in harsh environments. Residues under components can attract moisture and lead to leakage currents and the potential for electrochemical migration (...) The purpose of this research study is to evaluate innovative spray and soak methods for removing low residue flux residues and thoroughly rinsing under Bottom Termination and Leadless Components
Technical Library | 2022-04-26 03:27:56.0
The naming of the chip capacitor: The parameters included in the name of the chip capacitor include the size of the chip capacitor, the material used for this chip capacitor, the required accuracy, the required voltage, the required capacity, the requirements of the terminal and packaging requirements. Generally, the parameters to be provided for ordering a chip capacitor should be the size, the required accuracy, the voltage requirement, the capacity value, and the required brand.
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS)
The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Tue May 17 00:00:00 EDT 2022 - Thu May 19 00:00:00 EDT 2022 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference and Exhibition
Career Center | Oldsmar, Florida USA | Maintenance,Production
Job Description: • Performs a variety of tasks ranging from repetitive to non-repetitive production assembly operations on Sub-assemblies which includes installing cables and circuit card assemblies. • Ability to work from diagrams and drawings, ma
Challenges of Lead-Free Low Silver Content End Termination Pastes for Inductor Applications Challenges of Lead-Free Low Silver Content End Termination Pastes for Inductor Applications The silver end termination plays an important role
SMTnet Express, October 23, 2014, Subscribers: 23438, Members: Companies: 14072, Users: 37000 Combination of Spray and Soak Improves Cleaning under Bottom Terminations. Dr. Mike Bixenman; Kyzen Corporation , Julie Fields; Technical Devices Company
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_dimensions-for-terminal-and-component-outlines_topic2508.xml
PCB Libraries Forum : Dimensions for Terminal and Component Outlines PCB Libraries Forum : Dimensions for Terminal and Component Outlines This is an XML content feed of
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SolderTip #48: The Cleanliness of Wire and Terminal Connections | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
