Full Site - : panasert rh3 m size ll size (Page 22 of 28)

Re: PCB Component Legend Under SMT Pad/Land

Electronics Forum | Mon Sep 13 04:37:22 EDT 1999 | Brian

| I noticed that some of our pcb's component legend/designation are unreadable as they are placed under smt pads. Is this correct and according to standard? Although we don't have any problems with them as of now, I would like to know the effects on

Re: PCB Component Legend Under SMT Pad/Land

Electronics Forum | Mon Sep 13 09:49:16 EDT 1999 | John Thorup

| | I noticed that some of our pcb's component legend/designation are unreadable as they are placed under smt pads. Is this correct and according to standard? Although we don't have any problems with them as of now, I would like to know the effects o

Re: Pin-to-paste

Electronics Forum | Fri Apr 30 06:08:23 EDT 1999 | Scott Davies

Hi all, We're starting up tests for pin-to-paste and, well, things could be better. We're testing different pastes and we're testing different apertures rules and, well, we're still testing. It's coming close and we're getting pretty good joint

Re: 20 mil pitch applications

Electronics Forum | Tue Jan 12 00:33:30 EST 1999 | Jason

| | Our company is beginning to delve into some 20 mil applications and I'm curious to hear what kind of success others have had placing these components. What kind of fall out rates we might expect or any specific difficulties encountered and what

Tape & Reel Machine

Electronics Forum | Thu Feb 05 08:08:46 EST 2004 | stefwitt

To my point of view, you should be aware of some issues. Manual taping machines with a foot switch for tape advancement require quite a few adjustments before you start the job, like: Tape width adjustment, component rail adjustment, pitch setting,

Re: Via's in BGA pads

Electronics Forum | Wed Apr 21 14:38:38 EDT 1999 | Justin Medernach

| Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proces

Re: Solder Recovery System (SRS)

Electronics Forum | Fri Oct 09 16:33:08 EDT 1998 | Dave F

| Dave F asked me for an update on the SRS we evaluated last month... | | I like this machine. Over 80% of your wave dross is actually good solder; you just can't get to it without some type of separating agent. I like the mechanical sepration met

Solder Recovery System (SRS)

Electronics Forum | Fri Oct 09 15:06:22 EDT 1998 | Chrys

Dave F asked me for an update on the SRS we evaluated last month... I like this machine. Over 80% of your wave dross is actually good solder; you just can't get to it without some type of separating agent. I like the mechanical sepration method mu

Re: BGA Heat Sinks Adhesive Alternative

Electronics Forum | Mon Jun 21 16:36:54 EDT 1999 | John Thorup

| | | Does anyone have experience with placing heat sinks on BGAs? I have limited experience with PSA (pressure sensitive adhesives)heat sinks, and am interested with the possibility of a clip-on device. I am specifically concerned with ease of ass

Re: Who's Who's in Screen Printers for Contract Manufactuers

Electronics Forum | Sat Jun 13 00:33:41 EDT 1998 | Scott McKee

| Hidee Ho Brian! | Just like the other Steve, we just bought a SPM too. Our is brand new, and it's a SPM-AV (has vision). The other option we have is a automatic underside stencil cleaner. | We're a contract assembler as well, just starti


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